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參數(shù)資料
| 型號： | TPS2421-2DDAR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 電源管理 |
| 英文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 |
| 封裝： | PLATSIC, SOP-8 |
| 文件頁數(shù)： | 7/24頁 |
| 文件大?。?/td> | 1297K |
| 代理商： | TPS2421-2DDAR |
www.ti.com
SLUS907D – JANUARY 2009 – REVISED AUGUST 2010
Start Up Into a Short
The controller attempts to power on into a short for the duration of the timer. Figure 20 shows a small current
resulting from power limiting the internal MOSFET. This happens only once for the latch off part, TPS2421-1. For
the retry part, TPS2421-2, Figure 19 shows this cycle repeating at an interval based on the CT time.
Shutdown Modes
Hard Overload - Fast Trip
When a hard overload causes the load current to exceed ~1.6 × ISET the TPS2421 immediately shuts off current
to the load without waiting for the fault timer to expire. After such a shutoff the TPS2421 enters into startup mode
and attempts to apply power to the load.
If the hard overload is caused by a current transient, then a normal startup can be expected with a low probability
of disruption to the load, assuming there is sufficient load capacitance to hold up the load during the fractions of
a millisecond that make up the fast trip/restart cycle.
If the hard overload is caused by a real, continuous failure then the TPS2421 goes into current limit during the
attempt at restart. The timer starts and eventually runs out, shutting off current to the load. See the fast trip
Figure 17. When the hard overload occurs the current is turned off, the PG pin becomes false, and the FLT pin
stays false. The FLT pin becomes true only when the fault timer times out.
Overcurrent Shutdown
Overcurrent shutdown occurs when the output current exceeds ISET for the duration of the fault timer. Figure 9
shows a step rise in output current which exceeds the IFLT threshold but not the IMAX threshold. The increased
current is on for the duration of the timer. At conclusion of the timer, the output is turned off.
Layout
Support Components
Locate all TPS2421 support components, RSET, CT, etc. or any input or output voltage clamps, close to their
connection pin. Connect the other end of the component to the inner layer GND without trace length.
PowerPad
When properly mounted the PowerPad package provides significantly greater cooling ability than an ordinary
package. To operate at rated power the Power Pad must be soldered directly to the PC board GND plane
directly under the device. The PowerPad is at GND potential and can be connected using multiple vias to inner
layer GND. Other planes, such as the bottom side of the circuit board can be used to increase heat sinking in
higher current applications.
Refer to Technical Briefs: PowerPAD Thermally Enhanced Package (TI Literature Number SLMA002) and
PowerPAD Made Easy (TI Literature Number SLMA004) for more information on using this PowerPadTM
package.These documents are available at www.ti.com (Search by Keyword).
Copyright 2009–2010, Texas Instruments Incorporated
15
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