參數(shù)資料
型號： TPS40054QPWPRQ1
廠商： TEXAS INSTRUMENTS INC
元件分類： 穩(wěn)壓器
英文描述： SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO16
封裝： PLASTIC, HTSSOP-16
文件頁數(shù)： 15/28頁
文件大?。?/td> 571K
代理商： TPS40054QPWPRQ1
www.ti.com
Thermal Pad
6,60 mm
6,20 mm
4,50 mm
4,30 mm
8
1
2,31 mm
1,75 mm
5,10 mm
4,90 mm
2,46 mm
1,86 mm
MOSFET PACKAGING
GROUNDING AND CIRCUIT LAYOUT CONSIDERATIONS
TPS40054-Q1, TPS40055-Q1, TPS40057-Q1
SLAS482A – AUGUST 2005 – REVISED NOVEMBER 2005
LAYOUT CONSIDERATIONS (continued)
plugged when the copper plating is performed, then a solder mask material should be used to cap the vias with a
diameter equal to the via diameter of 0,1 mm minimum. This capping prevents the solder from being wicked
through the thermal vias and potentially creating a solder void under the package. See the PowerPAD Thermally
Enhanced Package[2] and the mechanical illustration at the end of this document for more information on the
PowerPAD package.
Figure 16. PowerPAD Dimensions
MOSFET package selection depends on MOSFET power dissipation and the projected operating conditions. In
general, for a surface-mount applications, the DPAK style package provides the lowest thermal impedance (
θ
JA)
and, therefore, the highest power dissipation capability. However, the effectiveness of the DPAK depends on
proper layout and thermal management. The
θ
JA specified in the MOSFET data sheet refers to a given copper
area and thickness. In most cases, a lowest thermal impedance of 40
°C/W requires one square inch of 2-ounce
copper on a G-10/FR-4 board. Lower thermal impedances can be achieved at the expense of board area. See
the selected MOSFET's data sheet for more information regarding proper mounting.
The TPS4005x provides separate signal ground (SGND) and power ground (PGND) pins. It is important that
circuit grounds are properly separated. Each ground should consist of a plane to minimize its impedance if
possible. The high power noisy circuits such as the output, synchronous rectifier, MOSFET driver decoupling
capacitor (BP10), and the input capacitor should be connected to PGND plane at the input capacitor.
Sensitive nodes such as the FB resistor divider RT) and ILIM should be connected to the SGND plane. The
SGND plane should only make a single point connection to the PGND plane.
Component placement should ensure that bypass capacitors (BP10 and BP5) are located as close as possible to
their respective power and ground pins. Also, sensitive circuits such as FB, RT, and ILIM should not be located
near high dv/dt nodes such as HDRV, LDRV, BOOST, and the switch node (SW).
22
相關(guān)PDF資料
PDF描述
TPS40070PWPRG4 2 A SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO16
TPS40071PWPR 2 A SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO16
TPS40070PWPR 2 A SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO16
TPS40074RHLT 2 A SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PQCC20
TPS40074RHLRG4 2 A SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PQCC20
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPS40055 制造商:TI 制造商全稱:Texas Instruments 功能描述:WIDE INPUT SYNCHRONOUS BUCK CONTROLLER
TPS40055-EP 制造商:TI 制造商全稱:Texas Instruments 功能描述:WIDE-INPUT SYNCHRONOUS BUCK CONTROLLER
TPS40055EVM-001 功能描述:電源管理IC開發(fā)工具 Eval Mod Converter RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V
TPS40055EVM-002 功能描述:電源管理IC開發(fā)工具 Wide Input Range Converter RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V
TPS40055MPWPREP 功能描述:DC/DC 開關(guān)控制器 Mil Enh Wide Input Synch Buck Cntrlr RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*