參數(shù)資料
型號: TPS40131RHBTG4
廠商: TEXAS INSTRUMENTS INC
元件分類: 穩(wěn)壓器
英文描述: SWITCHING CONTROLLER, 1200 kHz SWITCHING FREQ-MAX, PQCC32
封裝: GREEN, PLASTIC, QFN-32
文件頁數(shù): 10/40頁
文件大?。?/td> 940K
代理商: TPS40131RHBTG4
www.ti.com
PowerPAD Layout
SLVS635 – FEBRUARY 2007
APPLICATION INFORMATION (continued)
The PowerPAD package provides low thermal impedance for heat removal from the device. The PowerPAD
derives its name and low thermal impedance from the large bonding pad on the bottom of the device. The circuit
board must have an area of solder-tinned-copper underneath the package. The dimensions of this area depend
on the size of the PowerPAD package.
Thermal vias connect this area to internal or external copper planes and should have a drill diameter sufficiently
small so that the via hole is effectively plugged when the barrel of the via is plated with copper. This plug is
needed to prevent wicking the solder away from the interface between the package body and the solder-tinned
area under the device during solder reflow. Drill diameters of 0.33 mm (13 mils) works well when 1-oz. copper is
plated at the surface of the board while simultaneously plating the barrel of the via. If the thermal vias are not
plugged when the copper plating is performed, then a solder mask material should be used to cap the vias with
a diameter equal to the via diameter plus 0.1 mm minimum. This capping prevents the solder from being wicked
through the thermal vias and potentially creating a solder void under the package. Refer to PowerPAD
Thermally Enhanced Package (SLMA002) for more information on the PowerPAD package.
18
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