
SLVSA23 – SEPTEMBER 2009......................................................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1) (2)
TJ
PACKAGE
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 125°C
SOIC – D
Reel of 2500
TPS5410QDRQ1
5410Q
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
(2)
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2)
VALUE
UNIT
VIN
–0.3 to 40(3)
BOOT
–0.3 to 50
PH (steady-state)
–0.6 to 40(3)
VI
Input voltage range
EN
–0.3 to 7
V
VSENSE
–0.3 to 3
BOOT-PH
10
PH (transient < 10 ns)
–1.2
IO
Source current
PH
Internally Limited
Ilkg
Leakage current
PH
10
μA
TJ
Operating virtual junction temperature range
–40 to 150
°C
Tstg
Storage temperature
–65 to 150
°C
Human-Body Model (HBM)
1000
ESD
Electrostatic discharge protection
Machine Model (MM)
150
V
Charged-Device Model (CDM)
1000
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
Approaching the absolute maximum rating for the VIN pin may cause the voltage on the PH pin to exceed the absolute maximum rating.
DISSIPATION RATINGS
(1) (2)
THERMAL IMPEDANCE
PACKAGE
JUNCTION-TO-AMBIENT
8 Pin D (3)
75°C/W
(1)
Maximum power dissipation may be limited by overcurrent protection.
(2)
Power rating at a specific ambient temperature TA should be determined with a junction temperature of 125°C. This is the point where
distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or
below 125°C for best performance and long-term reliability. See Thermal Calculations in applications section of this data sheet for more
information.
(3)
Test board conditions:
(a) 3 in x 3 in, 2 layers, thickness: 0.062 inch.
(b) 2 oz. copper traces located on the top and bottom of the PCB.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
VI
Input voltage range, VIN
5.5
36
V
TJ
Operating junction temperature
–40
125
°C
2
Copyright 2009, Texas Instruments Incorporated