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Transient Response
As with any regulator, increasing the size of the output capacitor will reduce over/undershoot magnitude but
increase duration of the transient response. In the adjustable version, adding C
between OUT and FB will
improve stability and transient response. The transient response of the TPS799xx is enhanced by an active
pull-down that engages when the output overshoots by approximately 5% or more when the device is enabled.
When enabled, the pull-down device behaves like a 350
resistor to ground.
Under-Voltage Lock-Out (UVLO)
The TPS799xx utilizes an under-voltage lock-out circuit to keep the output shut off until internal circuitry is
operating properly. The UVLO circuit has a de-glitch feature so that it will typically ignore undershoot transients
on the input if they are less than 50μs duration.
Minimum Load
The TPS799xx is stable and well-behaved with no output load. To meet the specified accuracy, a minimum load
of 500μA is required. Below 500μA at junction temperatures near +125°C, the output can drift up enough to
cause the output pull-down to turn on. The output pull-down will limit voltage drift to 5% typically but ground
current could increase by approximately 50μA. In typical applications, the junction cannot reach high
temperatures at light loads since there is no appreciable dissipated power. The specified ground current would
then be valid at no load in most applications.
Thermal Information
Thermal Protection
Thermal protection disables the output when the junction temperature rises to approximately +165°C, allowing
the device to cool. When the junction temperature cools to approximately +145°C the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage due to
overheating.
Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in
the PCB layout. The PCB area around the device that is free of other components moves the head from the
device to the ambient air. Performance data for JEDEC low- and high-K boards are given in the
Dissipation
Ratings
table. Using heavier copper will increase the effectiveness in removing heat from the device. The
addition of plated through-holes to heat-dissipating layers will also improve the heatsink effectiveness.
P
D
V
IN
V
OUT
I
OUT
(2)
Package Mounting
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TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
SBVS056C–JANUARY 2005–REVISED MAY 2005
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heatsink. For reliable operation, junction temperature should be limited to +125°C maximum. To estimate the
margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal
protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should
trigger at least +35°C above the maximum expected ambient condition of your particular application. This
configuration produces a worst-case junction temperature of +125°C at the highest expected ambient
temperature and worst-case load.
The internal protection circuitry of the TPS799xx has been designed to protect against overload conditions. It
was not intended to replace proper heatsinking. Continuously running the TPS799xx into thermal shutdown will
degrade device reliability.
Power dissipation depends on input voltage and load conditions. Power dissipation is equal to the product of the
output current time the voltage drop across the output pass element, as shown in
Equation 2
:
13