參數(shù)資料
型號: TS4956EIKJT
廠商: STMICROELECTRONICS
元件分類: 音頻/視頻放大
英文描述: 1.055 W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA18
封裝: ROHS COMPLIANT, FCP-18
文件頁數(shù): 42/52頁
文件大?。?/td> 1709K
代理商: TS4956EIKJT
TS4956
Package mechanical data
47/51
5
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
5.1
18-bump flip-chip package
Figure 134. Footprint recommendations
Die size: 2.5x2.4 mm ± 30m
Die height (including bumps): 600m
Bumps diameter: 315m ±50m
Bump diameter before reflow: 300m ±10m
Bumps height: 250m ±40m
Die height: 350m ±20m
Pitch: 500m ±50m
Coplanarity: 50m max
866
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866
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500
m
750
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2500
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2400
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600
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866
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866
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500
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750
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2500
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2400
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600
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