參數(shù)資料
型號(hào): TS4962MEIJT
廠商: STMICROELECTRONICS
元件分類: 音頻/視頻放大
英文描述: 3 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9
封裝: ROHS COMPLIANT, FCP-9
文件頁(yè)數(shù): 32/41頁(yè)
文件大?。?/td> 1104K
代理商: TS4962MEIJT
Package information
TS4962M
38/41
8
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 72.
Pin-out for 9-bump flip-chip (top view)
Figure 73.
Marking for 9-bump flip-chip (top view)
Figure 74.
Mechanical data for 9-bump flip-chip
V
DD
1/A1
7/C1
8/C2
9/C3
4/B1
6/B3
2/A2
3/A3
5/B2
V
DD
IN
-
IN
+
GND
STBY
GND
OUT
+
OUT
-
V
DD
1/A1
7/C1
8/C2
9/C3
4/B1
6/B3
2/A2
3/A3
5/B2
V
DD
IN
-
IN
+
GND
STBY
GND
OUT
+
OUT
-
Bumps are underneath
Bump diameter = 300
μm
ST Logo
Symbol for lead-free: E
Two first XX product code: 62
third X: Assembly code
Three digits date code: Y for year - WW for week
The dot is for marking pin A1
XXX
YWW
E
XXX
YWW
E
Die size: 1.6mm x 1.6mm
±30μm
Die height (including bumps): 600
μm
Bump diameter: 315
μm ±50μm
Bump diameter before reflow: 300
μm ±10μm
Bump height: 250
μm ±40μm
Die height: 350
μm ±20μm
Pitch: 500
μm ±50μm
Coplanarity: 50
μm max
1.60 mm
0.5mm
0.25mm
1.60 mm
0.5mm
0.25mm
600m
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