參數(shù)資料
型號： TS4995EIJT
廠商： STMICROELECTRONICS
元件分類： 音頻／視頻放大
英文描述： 1.2 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9
封裝： LEAD FREE, FCP-9
文件頁數(shù)： 16/26頁
文件大?。?/td> 440K
代理商： TS4995EIJT
TS4995
Package information
23/26
5
Package information
T
o meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 59.
9-bump flip-chip package mechanical drawing
Figure 60.
Tape and reel schematics
1.63 mm
0.5mm
0.25mm
1.63 mm
0.5mm
0.25mm
600m
– Die size: 1.63mm x 1.63mm ± 30m
– Die height (including bumps): 600m
– Bumps diameter: 315m ±50m
– Bump diameter before reflow: 300m ±10m
– Bumps height: 250m ±40m
– Die height: 350m ±20m
– Pitch: 500m ±50m
– Coplanarity: 60m max
User direction of feed
A
1
A
1
8
Die size X + 70m
Die
siz
e
Y
+
70
m
4
1.5
4
All dimensions are in mm
User direction of feed
A
1
A
1
8
Die size X + 70m
Die
siz
e
Y
+
70
m
4
1.5
4
All dimensions are in mm
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