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參數(shù)資料
| 型號： | TS616IDWT |
| 廠商： | 意法半導(dǎo)體 |
| 元件分類： | 運動控制電子 |
| 英文描述： | DUAL WIDE BAND OPERATIONAL AMPLIFIER WITH HIGH OUTPUT CURRENT |
| 中文描述： | 雙寬帶運放的大輸出電流 |
| 文件頁數(shù)： | 18/27頁 |
| 文件大?。?/td> | 2728K |
| 代理商： | TS616IDWT |
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TS616
18/27
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
In the ADSL frequency range, printed circuit board
parasites can affect the closed-loop performance.
The implementation of a proper ground plane on
both sides of the PCB is mandatory to provide low
inductance and low resistance common return.
The most important factors affecting gain flatness
and bandwidth are stray capacitances at the out-
put and inverting input. To minimize these capaci-
tances, the space between signal lines and
ground plane should be increased. Feedback
components connections must be as short as pos-
sible in order to decrease the associated induc-
tance which affects high frequency gain errors. It
is very important to choose the smallest possible
external components, for example, surface
mounted devices (SMD) in order to minimize the
size of all DC and AC connections.
THERMAL INFORMATION
The TS616 is housed in an Exposed-Pad plastic
package. As depicted in figure 55, this package
uses a lead frame upon which the die is mounted.
This lead frame is exposed as a thermal pad on
the underside of the package. The thermal contact
is direct with the dice. This thermal path provides
excellent colling.
The thermal pad is electrically isolated from all
pins in the package. It should be soldered to a
copper area of the PCB underneath the package.
Through these thermal paths within this copper ar-
ea, heat can be conducted away from the pack-
age. In this case, the copper area should be con-
nected to (-
V
CC
).
Figure 55:
Exposed-Pad Package
Figure 56:
Evaluation Board
Cross Section View
Bottom View
Side View
DICE
1
D
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PDF描述 |
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| TS61C23CXRF | Voltage Detector |
| TS61C24CXRF | Voltage Detector |
| TS61C25CXRF | Voltage Detector |
| TS61C27CXRF | Voltage Detector |
| TS61C30CXRF | Voltage Detector |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TS617ID | 功能描述:運算放大器 - 運放 DUAL WIDEBAND HIGH OUTPUT CURRENT OPAMP RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TS617IDT | 功能描述:運算放大器 - 運放 Dual wideband Hi-output Amp. RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TS61C20CXRF | 制造商:TSC 制造商全稱:Taiwan Semiconductor Company, Ltd 功能描述:Voltage Detector |
| TS61C23CXRF | 制造商:TSC 制造商全稱:Taiwan Semiconductor Company, Ltd 功能描述:Voltage Detector |
| TS61C24CXRF | 制造商:TSC 制造商全稱:Taiwan Semiconductor Company, Ltd 功能描述:Voltage Detector |
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