![](http://datasheet.mmic.net.cn/260000/TSC2046EIPW_datasheet_15975901/TSC2046EIPW_18.png)
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
TSSOP
TSSOP
BGA MI
CROSTA
R JUNI
OR
VFBGA
TSSOP
TSSOP
TSSOP
Package
Drawing
PW
PW
ZQC
Pins Package
Qty
90
2000
2500
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TSC2046EIPW
TSC2046EIPWR
TSC2046EIZQCR
PREVIEW
PREVIEW
PREVIEW
16
16
48
None
None
None
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
TSC2046IGQCR
TSC2046IPW
TSC2046IPWR
TSC2046IPWRG4
ACTIVE
ACTIVE
ACTIVE
PREVIEW
GQC
PW
PW
PW
48
16
16
16
2500
100
2500
None
None
None
SNPB
Level-2A-235C-4 WKS
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
Level-1-260C-UNLIM
CU NIPDAU
CU NIPDAU
CU NIPDAU
Green (RoHS &
no Sb/Br)
None
2500 Green (RoHS &
no Sb/Br)
250
2500
Pb-Free
(RoHS)
TSC2046IRGVR
TSC2046IRGVRG4
ACTIVE
ACTIVE
QFN
QFN
RGV
RGV
16
16
2500
CU NIPDAU
CU NIPDAU
Level-1-235C-UNLIM
Level-1-260C-UNLIM
TSC2046IRGVT
TSC2046IZQCR
ACTIVE
ACTIVE
QFN
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
RGV
ZQC
16
48
None
CU NIPDAU
SNAGCU
Level-1-235C-UNLIM
Level-3-260C-168 HR
TSC2046IZQCR-90
ACTIVE
ZQC
48
2500
Pb-Free
(RoHS)
SNAGCU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jan-2005
Addendum-Page 1