參數(shù)資料
型號: TSC21020F-20MBSC
英文描述: IC CYCLONE III FPGA 25K 256 FBGA
中文描述: 數(shù)字信號處理器| 32位|的CMOS | RAD數(shù)據(jù)通信硬| QFL | 256PIN |陶瓷
文件頁數(shù): 43/51頁
文件大小: 763K
代理商: TSC21020F-20MBSC
43
TSC21020F
4153F
AERO
06/03
Figure 18.
Typical Output Delay or Hold vs. Load Capacitance (at Maximum Case
Temperature)
Figure 19.
Typical Output Delay or Hold vs. Load Capacitance (at Maximum Case
Temperature)
Environmental
Conditions
The TSC21020F is available in a Ceramic Pin Grid Array (CPGA) and in a multi-layer
quad flat package with flat leads (MQFPF).
The CPGA package uses a cavity-down configuration which gives it favorable thermal
characteristics. The top surface of the package contains a raised copper slug from
which much of the die heat is dissipated. The slug provides a surface for mounting a
heat sink (if required).
The military range TSC21020F is specified for operation at T
AMB
of -55
°
C to + 125
°
C.
Maximum T
CASE
(case temperature) can be calculated from the following equation:
T
CASE
= T
AMB
+ (PD x
θ
CA
)
–2
0
2
4
6
8
10
12
25
50
75
100
125
150
175
200
O
LOAD CAPACITANCE
pF
Note:
(1) OUTPUT PINS BG, TIMEXP, FLAG3
0,
PMD47
0, DMD39
0
(1)
8.3
1.7
3
2
1
0
1
2
3
4
25
50
75
LOAD CAPACITANCE
pF
100
125
150
175
200
O
Note:
(1) OUTPUT PINS PMA
23, PMS1
0, PMPAGE, DMA31
0,
DMS3
0, DMPAGE, TDO, PMRD, PMWR, DMRD, DMWR
2.2
(1)
2.8
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