參數(shù)資料
型號: TSL2550T
廠商: TAOS Inc.
英文描述: AMBIENT LIGHT SENSOR WITH SMBus INTERFACE
中文描述: 常溫與SMBus接口光傳感器
文件頁數(shù): 17/20頁
文件大?。?/td> 280K
代理商: TSL2550T
TSL2550
AMBIENT LIGHT SENSOR
WITH SMBus INTERFACE
TAOS029L
OCTOBER 2007
17
The
LUMENOLOGY
Company
Copyright 2007, TAOS Inc.
www.taosinc.com
MANUFACTURING INFORMATION
The D and T packages have been tested and have demonstrated an ability to be reflow soldered to a PCB
substrate. The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 5. TSL2550 Solder Reflow Profile
PARAMETER
REFERENCE
TSL2550D/TSL2550T
2.5
°
C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260
°
C (
0
°
C/+5
°
C)
Max
5
°
C/sec
Average temperature gradient in preheating
Soak time
Time above 217
°
C
Time above 230
°
C
Time above T
peak
10
°
C
Peak temperature in reflow
Temperature gradient in cooling
t
soak
t
1
t
2
t
3
T
peak
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale — for reference only
Time (sec)
T
Figure 14. TSL2550D/TSL2550T Solder Reflow Profile Graph
相關PDF資料
PDF描述
TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE
TSL2560 LIGHT-TO-DIGITAL CONVERTER
TSL2560CS LIGHT-TO-DIGITAL CONVERTER
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TSL2561 LIGHT-TO-DIGITAL CONVERTER
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