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參數(shù)資料
| 型號(hào)： | TSL2550T |
| 廠商： | TAOS Inc. |
| 英文描述： | AMBIENT LIGHT SENSOR WITH SMBus INTERFACE |
| 中文描述： | 常溫與SMBus接口光傳感器 |
| 文件頁數(shù)： | 18/20頁 |
| 文件大?。?/td> | 280K |
| 代理商： | TSL2550T |
TSL2550
AMBIENT LIGHT SENSOR
WITH SMBus INTERFACE
TAOS029L
OCTOBER 2007
18
Copyright 2007, TAOS Inc.
The
LUMENOLOGY
Company
www.taosinc.com
MANUFACTURING INFORMATION
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package molding compound.
Package D
To ensure the package molding compound contains the smallest amount of absorbed moisture possible, all
devices shipped in carrier tape have been pre-baked and shipped in a sealed moisture-barrier bag. No further
action is necessary if these devices are processed through solder reflow within 24 hours of the seal being broken
on the moisture-barrier bag.
However, for all devices shipped in tubes or if the seal on the moisture barrier bag has been broken for 24 hours
or longer, it is recommended that the following procedures be used to ensure the package molding compound
contains the smallest amount of absorbed moisture possible.
For devices shipped in tubes:
1.
Remove devices from tubes
2.
Bake devices for 4 hours, at 90
°
C
3.
After cooling, load devices back into tubes
4.
Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be
re-baked for 4 hours, at 90
°
C for a cumulative total of 12 hours (3 bakes for 4 hours at 90
°
C).
For devices shipped in carrier tape:
1.
Bake devices for 4 hours, at 90
°
C in the tape
2.
Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be
re
baked for 4 hours in tape, at 90
°
C for a cumulative total of 12 hours (3 bakes for 4 hours at 90
°
C).
Package T
To ensure the package molding compound contains the smallest amount of absorbed moisture possible, each
device is dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope
with silica gel to protect them from ambient moisture during shipping, handling, and storage before use.
The T package has been assigned a moisture sensitivity level of MSL 3 and the devices should be stored under
the following conditions:
Temperature Range
Relative Humidity
Total Time
Opened Time
5
°
C to 50
°
C
60% maximum
6 months from the date code on the aluminized envelope — if unopened
168 hours or fewer
Rebaking will be required if the devices have been stored unopened for more than 6 months or if the aluminized
envelope has been open for more than 168 hours. If rebaking is required, it should be done at 90
°
C for 4 hours.
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|---|---|
| TSL2550 | AMBIENT LIGHT SENSOR WITH SMBus INTERFACE |
| TSL2560 | LIGHT-TO-DIGITAL CONVERTER |
| TSL2560CS | LIGHT-TO-DIGITAL CONVERTER |
| TSL2560T | LIGHT-TO-DIGITAL CONVERTER |
| TSL2561 | LIGHT-TO-DIGITAL CONVERTER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TSL2550T-CUT TAPE | 制造商:AMS 功能描述:TSL2550 Series 100 kHz 5.5 V Ambient Light Sensor w/ SMBus Interface - T-4 |
| TSL256 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Optoelectronic |
| TSL2560 | 制造商:TAOS 制造商全稱:TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS 功能描述:LIGHT-TO-DIGITAL CONVERTER |
| TSL2560CL | 功能描述:光學(xué)數(shù)位轉(zhuǎn)換器 Ambient Light Sensor SMBus RoHS:否 制造商:ams 數(shù)據(jù)總線寬度: 峰值波長:470 nm 最大工作頻率: 工作電源電壓: 工作電流: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:Chipscale-6 封裝:Reel |
| TSL2560CS | 功能描述:光學(xué)數(shù)位轉(zhuǎn)換器 Ambient Light Sensor Light to Digital RoHS:否 制造商:ams 數(shù)據(jù)總線寬度: 峰值波長:470 nm 最大工作頻率: 工作電源電壓: 工作電流: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:Chipscale-6 封裝:Reel |
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