參數(shù)資料
型號(hào)： TSPC106AVGSU66CG
英文描述： MEMORY CONTROLLER
中文描述： 內(nèi)存控制器
文件頁(yè)數(shù)： 1/40頁(yè)
文件大小： 569K
代理商： TSPC106AVGSU66CG
1
Features
Processor Bus Frequency Up to 66 MHz and 83.3 MHz
64-bit Data Bus and 32-bit Address Bus
L2 Cache Control for 256-Kbyte, 512-Kbyte, 1-Mbyte Sizes
Provides Support for Either Asynchronous SRAM, Burst SRAM
or Pipelined Burst SRAM
Compliant with PCI Specification, Revision 2.1
PCI Interface Operates at 20 to 33 MHz, 3.3V/5.0V-compatible
IEEE 1149.1-compliant, JTAG Boundary-scan Interface
P
D
Max = 1.7 Watts (66 MHz), Full Operating Conditions
Nap, Doze and Sleep Modes Reduce Power Consumption
Fully Compliant with MIL-STD-883 Class Q or According to Atmel Standards
Upscreenings Based on Atmel Standards
Full Military Temperature Range (-55
°
C
≤
T
C
≤
+125
°
C)
– Industrial Temperature Range (-40
°
C
≤
T
C
≤
+110
°
C)
V
CC
= 3.3V ± 5%
Available in a 303-ball CBGA or a 303-ball CBGA with Solder Column Interposer (SCI)
(CI-CGA) Package
Description
The TSPC106 provides an integrated, high-bandwidth, high-performance, TTL-com-
patible interface between a 60x processor, a secondary (L2) cache or up to a total of
four additional 60x processors, the PCI bus and main memory.
PCI support allows system designers to rapidly design systems using peripherals
already designed for PCI.
The TSPC106 uses an advanced 3.3V CMOS-process technology and maintains full
interface compatibility with TTL devices.
The TSPC106 integrates system testability and debugging features via JTAG bound-
ary-scan capability.
G suffix
CBGA 303
Ceramic Ball Grid Array
GS suffix
CI±CGA 303
Ceramic Ball Grid Array
with Solder Column Interposer (SCI)
PCI Bridge/
Memory
Controller
TSPC106
Rev. 2102B
–
HIREL
–
02/02
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