- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄365988 > TSPC603RVGS14LC MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC PDF資料下載
參數(shù)資料
| 型號(hào)： | TSPC603RVGS14LC |
| 英文描述： | MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC |
| 中文描述： | 微處理器| 32位|的CMOS | BGA封裝| 255PIN |陶瓷 |
| 文件頁數(shù)： | 36/42頁 |
| 文件大小： | 961K |
| 代理商： | TSPC603RVGS14LC |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁當(dāng)前第36頁第37頁第38頁第39頁第40頁第41頁第42頁
36
TSPC603R
2125A–12/01
A superscalar processor is one that issues multiple independent instructions into multiple pipe-
lines allowing instructions to execute in parallel. The 603r has five independent execution
units, one each for integer instructions, floating-point instructions, branch instructions,
load/store instructions, and system register instructions. The IU and the FPU each have dedi-
cated register files for maintaining operands (GPRs and FPRs, respectively), allowing integer
calculations and floating-point calculations to occur simultaneously without interference.
Because the PowerPC architecture can be applied to such a wide variety of implementations,
instruction timing among various PowerPC processors varies accordingly.
Preparation for
Delivery
Packaging
Microcircuits are prepared for delivery in accordance with MIL-PRF-38535.
Certificate of
Compliance
ATMEL-Grenoble offers a certificate of compliances with each shipment of parts, affirming the
products are in compliance either with MIL-STD-883 and guarantying the parameters not
tested at temperature extremes for the entire temperature range.
Handling
MOS devices must be handled with certain precautions to avoid damage due to accumulation
of static charge. Input protection devices have been designed in the chip to minimize the effect
of this static buildup. However, the following handling practices are recommended:
1.
Devices should be handled on benches with conductive and grounded surfaces.
2.
Ground test equipment, tools and operator.
3.
Do not handle devices by the leads.
4.
Store devices in conductive foam or carriers.
5.
Avoid use of plastic, rubber, or silk in MOS areas.
6.
Maintain relative humidity above 50 percent if practical.
Packages
Mechanical Data
The following sections provide the package parameters and mechanical dimensions for the
CBGA packages.
CBGA Package
Parameters
The package parameters are as provided in the following list. The package type is 21 mm,
255-lead ceramic ball grid array (CBGA).
Package outline
21 mm x 21 mm
255
Interconnects
Pitch
1.27 mm
Maximum module height
3.00 mm
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TSPC603RVGS6LC | MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC |
| TSPC603RVGS8LC | MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC |
| TSPC603RVGSU6LC | MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC |
| TSPC603RVGSU8LC | MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC |
| TSPC603RVGU10LC | MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TSPC603RVGS6LC | 功能描述:IC MPU 32BIT 6MHZ 255CI-CGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:60 系列:SCC 處理器類型:Z380 特點(diǎn):全靜電 Z380 CPU 速度:20MHz 電壓:5V 安裝類型:表面貼裝 封裝/外殼:144-LQFP 供應(yīng)商設(shè)備封裝:144-LQFP 包裝:托盤 |
| TSPC603RVGS8LC | 功能描述:IC MPU 32BIT 8MHZ 255CI-CGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:60 系列:SCC 處理器類型:Z380 特點(diǎn):全靜電 Z380 CPU 速度:20MHz 電壓:5V 安裝類型:表面貼裝 封裝/外殼:144-LQFP 供應(yīng)商設(shè)備封裝:144-LQFP 包裝:托盤 |
| TSPC603RVGSB/Q10L | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 603e RISC Microprocessor Family PID7t-603e |
| TSPC603RVGSB/Q10LC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC |
| TSPC603RVGSB/Q12L | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 603e RISC Microprocessor Family PID7t-603e |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。