參數(shù)資料
型號(hào)： TSPC603RVGSU14LC
元件分類(lèi)： 微處理器
英文描述： MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
中文描述： 微處理器| 32位|的CMOS | BGA封裝| 255PIN |陶瓷
文件頁(yè)數(shù)： 36/42頁(yè)
文件大小： 961K
代理商： TSPC603RVGSU14LC
36
TSPC603R
2125A–12/01
A superscalar processor is one that issues multiple independent instructions into multiple pipe-
lines allowing instructions to execute in parallel. The 603r has five independent execution
units, one each for integer instructions, floating-point instructions, branch instructions,
load/store instructions, and system register instructions. The IU and the FPU each have dedi-
cated register files for maintaining operands (GPRs and FPRs, respectively), allowing integer
calculations and floating-point calculations to occur simultaneously without interference.
Because the PowerPC architecture can be applied to such a wide variety of implementations,
instruction timing among various PowerPC processors varies accordingly.
Preparation for
Delivery
Packaging
Microcircuits are prepared for delivery in accordance with MIL-PRF-38535.
Certificate of
Compliance
ATMEL-Grenoble offers a certificate of compliances with each shipment of parts, affirming the
products are in compliance either with MIL-STD-883 and guarantying the parameters not
tested at temperature extremes for the entire temperature range.
Handling
MOS devices must be handled with certain precautions to avoid damage due to accumulation
of static charge. Input protection devices have been designed in the chip to minimize the effect
of this static buildup. However, the following handling practices are recommended:
1.
Devices should be handled on benches with conductive and grounded surfaces.
2.
Ground test equipment, tools and operator.
3.
Do not handle devices by the leads.
4.
Store devices in conductive foam or carriers.
5.
Avoid use of plastic, rubber, or silk in MOS areas.
6.
Maintain relative humidity above 50 percent if practical.
Packages
Mechanical Data
The following sections provide the package parameters and mechanical dimensions for the
CBGA packages.
CBGA Package
Parameters
The package parameters are as provided in the following list. The package type is 21 mm,
255-lead ceramic ball grid array (CBGA).
Package outline
21 mm x 21 mm
255
Interconnects
Pitch
1.27 mm
Maximum module height
3.00 mm
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