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參數(shù)資料
| 型號： | TSX83102G0BGS |
| 廠商： | ATMEL CORP |
| 元件分類： | ADC |
| 英文描述： | 1-CH 10-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CBGA152 |
| 封裝： | HERMATIC, CI-CGA-152 |
| 文件頁數(shù)： | 10/13頁 |
| 文件大?。?/td> | 446K |
| 代理商： | TSX83102G0BGS |
6
TS83102G0BMGS
5360AS–BDC–08/04
Thermal and Moisture Characteristics
Dissipation by Conduction and Convection
The thermal resistance from junction to ambient RTH
JA is around 30° C/W. Therefore, to lower
RTH
JA, it is mandatory to use an external heat sink to improve dissipation by convection and
conduction. The heat sink should be fixed in contact with the top side of the package (AI203
electrical isolation over CuW heat spreader).
The heat sink does not need to be electrically isolated, because the top of the package is
already electrically isolated thanks to a 0.30 mm AI203 layer.
Example:
The thermal resistance from case to ambient RTH
CA is typically 4.0° C/W (0 m/s air flow or
still air) with the heat sink depicted in Figure 3 on page 7, of dimensions 50 mm x 50 mm x
28 mm (respectively L x l x H).
The global junction to ambient thermal resistance RTH
JA is:
4.8
° C/W RTH
JC + 2.0° C/W thermal grease resistance + 4.0° C/W RTHCA (case to ambi-
ent) = 10.8
° C/W total (RTH
JA).
Assuming:
A typical thermal resistance from the junction to the top of the case RTH
JC of 4.8° C/W
(finite element method thermal simulation results): this value does not include the thermal
contact resistance between the package and the external heat sink (glue, paste, or ther-
mal foil interface, for example). As an example, use a 2.0
° C/W value for a
50 m thickness of thermal grease.
Note:
Example of the calculation of the ambient temperature T
A max to ensure TJ max = 110° C:
assuming RTH
JA = 10.8° C/W and power dissipation = 4.6 W, TA max = TJ - (RTHJA x 4.6 W) =
110 - (10.8 x 4.6) = 60.32
° C. T
A max can be increased by lowering RTHJA with an adequate air
flow ( 2 m/s, for example).
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