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參數(shù)資料
| 型號(hào)： | TSX83102G0BGS |
| 廠商： | ATMEL CORP |
| 元件分類(lèi)： | ADC |
| 英文描述： | 1-CH 10-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CBGA152 |
| 封裝： | HERMATIC, CI-CGA-152 |
| 文件頁(yè)數(shù)： | 11/13頁(yè) |
| 文件大小： | 446K |
| 代理商： | TSX83102G0BGS |
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7
TS83102G0BMGS
5360AS–BDC–08/04
Figure 3. Black Anodized Aluminium Heat Sink Glued on a Copper Base Screwed on Board (all dimensions in mm)
Note:
The cooling system efficiency can be monitored using the temperature sensing diodes integrated in the device.
Thermal Dissipation by Conduction Only
When the external heat sink cannot be used, the relevant thermal resistance is the thermal
resistance from the junction to the bottom of the columns: RTH
J-Bottom-of-columns.
The thermal path, in this case, is the junction, then the silicon, glue, CuW heat spreader, pack-
age Al2O3, and the columns (Sn10Pb90).
The Finite Element Method (FEM) with the thermal simulator leads to
RTH
J-bottom-of-columns = 7.4°C/W. This value assumes pure conduction from the junction to the
bottom of the columns (this is the worst case, no radiation and no convection is applied). With
such an assumption, RTH
J- Bottom-of-columns is user-independent.
To complete the thermal analysis, you must add the thermal resistance from the top of the
board (on which the device is soldered) to the ambient resistance, whose values are user-
dependent (the type of board, thermal, routing, area covered by copper in each board layer,
thickness, airflow or cold plate are all parameters to consider).
In the case of the CI-CGA 152 package, the thermal resistance from the junction to the top of
the package (via the CuW heat spreader covered by AI203) is
RTH
J-top-of-package = 4.8° C/W.
16 x 50
11.5 x 52
18.50
6.5
Board
0.3
2
50 x 50
50 x 52
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