參數(shù)資料
型號: TZA3019CVH
英文描述: TRANSIL
中文描述: 特定應(yīng)用功放|雙| LLCC | 32腳|塑料
文件頁數(shù): 9/28頁
文件大小: 138K
代理商: TZA3019CVH
2003 Apr 02
9
Philips Semiconductors
Product specification
30 Mbits/s up to 3.2 Gbits/s
A-rate
TM
laser drivers
TZA3011A; TZA3011B
8
In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to ground; positive
currents flow into the IC.
LIMITING VALUES
9
In compliance with JEDEC standards JESD51-5 and JESD51-7.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITION
MIN.
0.5
0.5
0.5
MAX.
UNIT
V
CCD
V
CCA
V
CCO
digital supply voltage
analog supply voltage
output stage supply voltage
+3.5
+3.5
+3.5
+5.3
4.5
4.1
4.5
4.5
4.5
5.2
3.6
3.6
4.1
V
V
V
V
V
V
V
V
V
V
V
V
V
3.3 V laser supply
5 V laser supply (TZA3011B only)
0.5
TZA3011A; V
CCO
= 3.3 V
TZA3011B; V
CCO
= 3.3 V
TZA3011B; V
CCO
= 5 V
TZA3011A; V
CCO
= 3.3 V
TZA3011B; V
CCO
= 3.3 V
TZA3011B; V
CCO
= 5 V
TZA3011A; V
CCO
= 3.3 V
TZA3011B; V
CCO
= 3.3 V
TZA3011B; V
CCO
= 5 V
V
o(LA)
output voltage at pin LA
1.2
0.8
1.2
1.8
1.6
2.0
0.4
0.4
0.8
V
o(LAQ)
output voltage at pin LAQ
V
BIAS
bias voltage
V
n
voltage on other input and output
pins
analog inputs and outputs
digital inputs and outputs
input current on pins
MAXOP,MAXMON,RREF,PWA,
ER and AVR
VTEMP, BIASOUT and MODOUT
ALOP, ALMON and MON
ambient temperature
junction temperature
storage temperature
0.5
0.5
V
CCA
+ 0.5
V
CCD
+ 0.5
V
V
I
n
1.0
0
mA
1.0
0
40
40
65
+1.0
5.0
+85
+125
+150
mA
mA
°
C
°
C
°
C
T
amb
T
j
T
stg
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to
ambient
4 layer printed circuit board in still
air with 9 plated vias connected
with the heatsink and the first
ground plane in the PCB
HBCC32 die pad soldered to
PCB
35
K/W
60
K/W
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