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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
SOIC
SOIC
SOIC
MSOP
MSOP
MSOP
MSOP
MSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
SOIC
SOIC
SOIC
PDIP
Package
Drawing
D
D
D
D
DGK
DGK
DGK
DGK
DGK
PW
PW
PW
PW
D
D
D
D
P
Pins Package
Qty
75
75
2500
2500
80
80
2500
2500
2500
150
150
2000
2000
75
75
2500
2500
50
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
UCC2809D-1
UCC2809D-2
UCC2809DTR-1
UCC2809DTR-2
UCC2809P-1
UCC2809P-2
UCC2809PTR-1
UCC2809PTR-1G4
UCC2809PTR-2
UCC2809PW-1
UCC2809PW-2
UCC2809PWTR-1
UCC2809PWTR-2
UCC3809D-1
UCC3809D-2
UCC3809DTR-1
UCC3809DTR-2
UCC3809N-1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PREVIEW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
None
None
None
None
None
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Call TI
Level-1-220C-UNLIM
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-NC-NC-NC
UCC3809N-2
ACTIVE
PDIP
P
8
50
CU NIPDAU
Level-NC-NC-NC
UCC3809P-1
UCC3809P-2
UCC3809PTR-1
UCC3809PW-1
UCC3809PW-2
UCC3809PWTR-1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
MSOP
MSOP
MSOP
TSSOP
TSSOP
TSSOP
DGK
DGK
DGK
PW
PW
PW
8
8
8
8
8
8
80
80
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
2000
150
150
2000
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
http://www.ti.com/productcontent
for the latest availability information and additional
product content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
Addendum-Page 1