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參數(shù)資料
| 型號： | UPC3025HB |
| 廠商： | NEC Corp. |
| 英文描述： | LOW-SATURATION STABILIZED POWER SUPPLY WITH ON/OFF FUNCTION (1 A OUTPUT) |
| 中文描述： | 低飽和度對穩(wěn)壓電源開/關(guān)功能（1 A輸出） |
| 文件頁數(shù)： | 10/12頁 |
| 文件大?。?/td> | 76K |
| 代理商： | UPC3025HB |
Data Sheet G15506EJ2V0DS
10
μ
PC3018, 3025
RECOMMENDED SOLDERING CONDITIONS
The
μ
PC3018, 3025 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual
(C10535E)
.
For soldering methods and conditions other than those recommended below, contact our sales representative.
Type of Surface Mount Device
μ
PC3018TJ,
μ
PC3025TJ: MP-3Z (5 pin)
Process
Conditions
Symbol
Infrared Ray Reflow
Peak temperature: 235°C,
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 times or less.
IR35-00-3
Vapor Phase Soldering
Peak temperature: 215°C,
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 3 times or less.
VP15-00-3
Wave Soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C MAX. (Package surface temperature).
WS60-00-1
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Remark
It is recommended to use a rosin-type flux with a low chlorine element (chlorine: 0.2 Wt% or less).
Type of Through-hole Device
μ
PC3018HB,
μ
PC3025HB: MP-3 (5 pin)
Process
Conditions
Wave Soldering
(only to leads)
Solder temperature: 260°C or below,
Flow time: 10 seconds or less
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that
the package body does not get jet soldered.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPC3025TJ | 制造商:NEC 制造商全稱:NEC 功能描述:LOW-SATURATION STABILIZED POWER SUPPLY WITH ON/OFF FUNCTION (1 A OUTPUT) |
| UPC3025TJ(AZ) | 制造商:Renesas Electronics Corporation 功能描述: |
| UPC3025TJ-E1 | 制造商:NEC 制造商全稱:NEC 功能描述:LOW-SATURATION STABILIZED POWER SUPPLY WITH ON/OFF FUNCTION (1 A OUTPUT) |
| UPC3025TJ-E2 | 制造商:NEC 制造商全稱:NEC 功能描述:LOW-SATURATION STABILIZED POWER SUPPLY WITH ON/OFF FUNCTION (1 A OUTPUT) |
| UPC3033H(AZ) | 制造商:Renesas Electronics Corporation 功能描述: |
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