參數(shù)資料
型號(hào)： UPD17147GTA1
廠商： NEC Corp.
英文描述： SMALL, GENERAL-PURPOSE 4-BIT SINGLE-CHIP MICROCONTROLLERS
中文描述： 小，通用4位單晶片微控制器
文件頁(yè)數(shù)： 94/102頁(yè)
文件大?。?/td> 408K
代理商： UPD17147GTA1
94
μ
PD17145(A1), 17147(A1), 17149(A1)
25. RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to Information Document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For the other soldering conditions and methods, consult NEC.
Table 25-1. Soldering Conditions of Surface Mount Type
μ
PD17145GT(A1)-
×××
: 28-pin plastic SOP (375 mil)
μ
PD17147GT(A1)-
×××
: 28-pin plastic SOP (375 mil)
μ
PD17149GT(A1)-
×××
: 28-pin plastic SOP (375 mil)
Symbol of Recommended
Soldering Method
Soldering Condition
Condition
Package peak temperature: 235
°
C, Time: 30 seconds max.
(210
°
C min.), Number of times: 2 max., Duration
Note
:
7 (after that, prebaking is necessary for 20 hours at 125
°
C.)
<Remarks>
(1)
Start second reflow after the device temperature that has
risen because of the first reflow has fallen to room
temperature.
(2)
Do not clean flux with water after the first reflow.
Package peak temperature: 215
°
C, Time: 40 seconds max.
(200 C min.), Number of times: 2 max., Duration
Note
:
7 (after that, prebaking is necessary for 20 hours at 125
°
C.)
<Remarks>
(1)
Start second reflow after the device temperature that has
risen because of the first reflow has fallen to room
temperature.
(2)
Do not clean flux with water after the first reflow.
Pin partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side
of device)
Note
Number of storage days after the dry pack was opened. Storage conditions: 25
°
C, 65 %RH max.
Caution
Do not use two or more soldering methods in combination (except pin partial heating).
Infrared reflow
VPS
IR35-207-2
VP15-207-2
—
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