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參數(shù)資料
| 型號： | UPD1724x |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLERS FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTERS |
| 中文描述： | 4位單片微控制器的小型通用兩用紅外遙控遞質(zhì) |
| 文件頁數(shù)： | 96/102頁 |
| 文件大?。?/td> | 461K |
| 代理商： | UPD1724X |
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96
Data Sheet U15002EJ1V0DS
μ
PD17240, 17241, 17242, 17243, 17244, 17245, 17246
17. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD17240, 17241, 17242, 17243, 17244, 17245, and 17246 should be soldered and mounted under the
following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 17-1. Surface Mounting Type Soldering Conditions
μ
PD17240MC-
×××
-5A4: 30-pin plastic SSOP (7.62 mm (300))
μ
PD17241MC-
×××
-5A4: 30-pin plastic SSOP (7.62 mm (300))
μ
PD17242MC-
×××
-5A4: 30-pin plastic SSOP (7.62 mm (300))
μ
PD17243MC-
×××
-5A4: 30-pin plastic SSOP (7.62 mm (300))
μ
PD17244MC-
×××
-5A4: 30-pin plastic SSOP (7.62 mm (300))
μ
PD17245MC-
×××
-5A4: 30-pin plastic SSOP (7.62 mm (300))
μ
PD17246MC-
×××
-5A4: 30-pin plastic SSOP (7.62 mm (300))
Recommended Condition
Symbol
Soldering Method
Soldering Conditions
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
(at 210
°
C or higher), Count: Three times or less
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max.
(at 200
°
C or higher), Count: Three times or less
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once, WS60-00-1
Preheating temperature: 120
°
C max. (package surface temperature)
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Caution
Do not use different soldering methods together (except for partial heating).
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