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參數(shù)資料
| 型號： | UPD4991AGS |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT PARALLEL I/O CALENDAR CLOCK |
| 中文描述： | 4位并行I / O日歷鐘 |
| 文件頁數(shù)： | 30/32頁 |
| 文件大小： | 133K |
| 代理商： | UPD4991AGS |
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μ
PD4991A
30
RECOMMENDED SOLDERING CONDITIONS
The following conditions must be met when soldering this product. Please consult with our sales offices when using
other soldering process or under different conditions.
Type of Surface Mounting Device
μ
PD4991 AGS
Soldering process
Soldering conditions
Symbols
Infrared ray reflow
Peak temperature of package surface: 235
°
C or below,
Reflow time: 30 seconds or less (210
°
C or higher),
Number of reflow process: 2, Exposure limit*: None
IR35-00-2
VPS
Peak temperature of package surface: 215
°
C or below,
Reflow time: 40 seconds or less (200
°
C or higher),
Number of reflow process: 2, Exposure limit*: None
VP15-00-2
Wave soldering
Soldering temperature: 260
°
C or below
Flow time: 10 seconds or less, Number of reflow process: 1,
Exposure limit*: None
WS60-00-1
Partial heating
method
Pin temperature: 300
°
C or below,
Time: 10 seconds or below (per side of leads)
—
*
Exposure limit before soldering after dry-pack is opened.
Storage condition: 25
°
C and relative humidity at 65 % or less.
Caution Do not apply more than a single process once, except for “Partial heating method.”
Type of Through-Hole Device
μ
PD4991 ACX
Soldering process
Soldering conditions
Wave soldering
Soldering temperature: 260
°
C or below
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|---|---|
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