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參數(shù)資料
| 型號： | UPD6104C001 |
| 英文描述： | Consumer IC |
| 中文描述： | 消費性IC |
| 文件頁數(shù)： | 30/36頁 |
| 文件大?。?/td> | 252K |
| 代理商： | UPD6104C001 |
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μ
PD61P24
30
22. RECOMMENDED SOLDERING CONDITIONS
It is recommended that
μ
PD6124A and 6600A be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document,
Semiconductor Device
Mounting Technology Manual
(C10535E)
.
For other soldering methods and conditions, consult NEC.
Table 22-1. Soldering Conditions of Surface-Mount Type
μ
PD61P24GS: 20-pin plastic SOP (300 mil)
Soldering Method
Soldering Conditions
Partial Heating
Pin temperature: 300
°
C max., time: 3 seconds max. (per device side)
Table 22-2. Soldering Conditions of Through-Hole Type
μ
PD61P24CS: 20-pin plastic shrink DIP (300 mil)
Soldering Method
Soldering Conditions
Wave Soldering (Only for pin part)
Solder bath temperature: 260
°
C max., time: 10 seconds max.
Partial Heating
Pin temperature: 300
°
C max., time: 3 seconds max. (per pin)
Caution When soldering this product using of wave soldering, exercise care that the solder does not come
in direct contact with the package.
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