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| 型號(hào)： | UPD6P4BMC-5A4 |
| 廠(chǎng)商： | NEC Corp. |
| 英文描述： | MS3112E22-32S |
| 中文描述： | 4位單片機(jī)的紅外遙控傳輸 |
| 文件頁(yè)數(shù)： | 26/32頁(yè) |
| 文件大?。?/td> | 187K |
| 代理商： | UPD6P4BMC-5A4 |
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26
μ
PD6P4B
Data Sheet U13594EJ2V0DS00
8. RECOMMENDED SOLDERING CONDITIONS
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
sales representatives.
Table 8-1. Soldering Conditions for Surface-Mount Type
(1)
μ
PD6P4BGS-
×××
: 20-pin plastic SOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 secs. max. (210
°
C min.),
Number of times: Twice max.
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 secs. max. (200
°
C min.),
VP15-00-2
Number of times: Twice max.
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 secs. max., Number of times: once,
Preheating temperature: 120
°
C max. (package surface temperature.)
Pin temperature: 300
°
C or less ; time: 3 secs or less (for each side of the device)
WS60-00-1
Partial heating
—
Caution Do not use two or more soldering methods in combination (except partial heating).
(2)
μ
PD6P4BMC-5A4: 20-pin plastic SSOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 secs. max. (210
°
C min.),
Number of times: Three times max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 secs. max. (200
°
C min.),
VP15-00-3
Number of times: Three times max.
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 secs. max., Number of times: once,
Preheating temperature: 120
°
C max. (package surface temperature.)
Pin temperature: 300
°
C or less ; time: 3 secs or less (for each side of the device)
WS60-00-1
Partial heating
—
Caution Do not use two or more soldering methods in combination (except partial heating).
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