參數(shù)資料
型號: UPD70208HGK-20-9EU
廠商: NEC Corp.
英文描述: V40HLTM, V50HLTM 16/8, 16-BIT MICROPROCESSOR
中文描述: V40HLTM,V50HLTM 16 / 8,16位微處理器
文件頁數(shù): 105/110頁
文件大?。?/td> 625K
代理商: UPD70208HGK-20-9EU
μ
PD70208H, 70216H
105
Data Sheet U13225EJ4V0DS00
(2)
μ
PD70208HGK-
×
-9EU : 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
μ
PD70216HGK-
×
-9EU : 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
(a) K, E, X masks
Soldering Method
Soldering Conditions
Recommended
Conditions Symbol
Infrared reflow
Package peak temperature : 230
°
C, Time: 30 sec. max. (210
°
C min.),
Number of timers: 1, Number of days
Note
: 1 day (after this, prebaking is necessary
at 125
°
C for 10 hours)
IR30-101-1
VPS
Package peak temperature: 215
°
C, Time: 40 sec. max. (200
°
C min.),
Number of times: 1, Number of days
Note
: 1 day (after this, prebaking is necessary
at 125
°
C for 10 hours)
VP15-101-1
Partial pin heating
Pin temperature: 300
°
C max., Time: 3 sec. max. (per device side)
(b) P, M, L, F masks
Soldering Method
Soldering Conditions
Recommended
Conditions Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec. max. (210
°
C min.),
Number of times: 2 max., Number of days
Note
: 7 days (after this, prebaking is
necessary at 125
°
C for 10 hours).
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 sec. (200
°
C min.), Number of times:
2 max., Number of days
Note
: 7 days (after this prebaking is necessary at 125
°
C
for 10 hours).
VP15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 sec. max. (per device side)
Note
This means the number of days after unpacking the dry pack. Storage conditions are 25
°
C and 65% RH
max.
Caution Do not use one soldering method in combination with another. (however, partial pin heating can
be performed with other soldering methods).
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