參數(shù)資料
型號： UPD70216HGF-12-3B9
廠商： NEC Corp.
英文描述： V40HLTM, V50HLTM 16/8, 16-BIT MICROPROCESSOR
中文描述： V40HLTM，V50HLTM 16 / 8，16位微處理器
文件頁數(shù)： 103/110頁
文件大小： 625K
代理商： UPD70216HGF-12-3B9
μ
PD70208H, 70216H
103
Data Sheet U13225EJ4V0DS00
18. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For the details of recommended soldering conditions for the surface mounting type, refer to the information document
Semiconductor Device Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact our salesman.
Table 18-1. Soldering Conditions
(1)
μ
PD70208HGF-
×
-3B9 : 80-pin plastic QFP (14
×
20 mm)
μ
PD70216HGF-
×
-3B9 : 80-pin plastic QFP (14
×
20 mm)
(a) K, E, X masks
Soldering Method
Soldering Conditions
Recommended
Conditions Symbol
Infrared reflow
Package peak temperature : 230
°
C, Time: 30 sec. max. (210
°
C min.),
Number of times: 1, Number of days
Note
: 7 days (after this, prebaking is necessary
at 125
°
C for 10 hours)
IR30-107-1
VPS
Package peak temperature: 215
°
C, Time: 40 sec. max. (200
°
C min.),
Number of times: 1, Number of days
Note
: 7 days (after this, prebaking is necessary
at 125
°
C for 10 hours)
VP15-107-1
Wave soldering
Solder bath temperature: 260
°
C max. Time: 10 sec. max., Number of times: 1,
Preheating temperature: 120
°
C max. (Package surface temperature), Number of
days
Note
: 7 days (after this, prebaking is necessary at 125
°
C for 10 hours).
WS60-107-1
Partial pin heating
Pin temperature: 300
°
C max., Time: 3 sec. max. (per device side)
—
(b) P, M masks
Soldering Method
Soldering Conditions
Recommended
Conditions Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec. max. (210
°
C min.),
Number of times: 2 max., Number of days
Note
: 7 days (after this, prebaking is
necessary at 125
°
C for 20 hours).
IR35-207-2
VPS
Package peak temperature: 215
°
C, Time: 40 sec. (200
°
C min.)
Number of times: 2 max., Number of days
Note
: 7 days (after this prebaking is
necessary at 125
°
C for 20 hours).
VP15-207-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 sec. max.,
Number of times: 1, Preheating temperature: 120
°
C max. (Package surface
temperature). Number of days
Note
: 7 days (after this, prebaking is necessary at
125
°
C for 20 hours).
WS60-207-1
Partial pin heating
Pin temperature: 300
°
C max., Time: 3 sec. max. (per device side)
—
Note
This means the number of days after unpacking the dry pack. Storage conditions are 25
°
C and 65% RH
max.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD70216HGF-16-3B9 制造商:NEC 制造商全稱:NEC 功能描述:V40HLTM, V50HLTM 16/8, 16-BIT MICROPROCESSOR
UPD70216HGF-20-3B9 制造商:NEC 制造商全稱:NEC 功能描述:V40HLTM, V50HLTM 16/8, 16-BIT MICROPROCESSOR
UPD70216HGK-10-9EU 制造商:NEC 制造商全稱:NEC 功能描述:V40HLTM, V50HLTM 16/8, 16-BIT MICROPROCESSOR
UPD70216HGK-12-9EU 制造商:NEC 制造商全稱:NEC 功能描述:V40HLTM, V50HLTM 16/8, 16-BIT MICROPROCESSOR
UPD70216HGK-16-9EU 制造商:NEC 制造商全稱:NEC 功能描述:V40HLTM, V50HLTM 16/8, 16-BIT MICROPROCESSOR
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