- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄376429 > UPD703015AYGC (NEC Corp.) V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER PDF資料下載
參數(shù)資料
| 型號： | UPD703015AYGC |
| 廠商： | NEC Corp. |
| 英文描述： | V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER |
| 中文描述： | V850/SA1TM 32-/16-BIT單片機 |
| 文件頁數(shù)： | 44/48頁 |
| 文件大?。?/td> | 309K |
| 代理商： | UPD703015AYGC |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁當前第44頁第45頁第46頁第47頁第48頁
Data Sheet U14526EJ2V0DS00
44
μ
PD703014A, 703014AY, 703015A, 703015AY, 703017A, 703017AY
4. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD703014A, 703014AY, 703015A, 703015AY, 703017A, and 703017AY should be soldered and mounted
under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 4-1. Surface Mounting Type Soldering Conditions
(1)
μ
PD703014AGC-
μ
PD703014AYGC-
μ
PD703015AGC-
μ
PD703015AYGC-
μ
PD703017AGC-
μ
PD703017AYGC-
×××
-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
(2)
μ
PD703014AF1-
×××
μ
PD703014AYF1-
×××
μ
PD703015AF1-
μ
PD703015AYF1-
×××
μ
PD703017AF1-
×××
μ
PD703017AYF1-
-EA6: 121-pin plastic FBGA (12
×
12)
-EA6: 121-pin plastic FBGA (12
×
12)
×××
-EA6: 121-pin plastic FBGA (12
×
12)
-EA6: 121-pin plastic FBGA (12
×
12)
-EA6: 121-pin plastic FBGA (12
×
12)
×××
-EA6: 121-pin plastic FBGA (12
×
12)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 hours)
IR35-107-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
相關PDF資料 |
PDF描述 |
|---|---|
| UPD703015AGC | V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD703014A | V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD703014AF1 | V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD703014AGC | V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD703014AY | V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UPD703015B | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:V850 Family(TM) for Architecture | User＇s Manual[03/2001] |
| UPD703015BGC-XXX-8EU | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROCONTROLLER|32-BIT|V850 CPU|CMOS|QFP|100PIN|PLASTIC |
| UPD703015BY | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:V850 Family(TM) for Architecture | User＇s Manual[03/2001] |
| UPD703015BYGC-XXX-8EU | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROCONTROLLER|32-BIT|V850 CPU|CMOS|QFP|100PIN|PLASTIC |
| UPD703015Y | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:V850 Family(TM) for Architecture | User＇s Manual[03/2001] |
發(fā)布緊急采購，3分鐘左右您將得到回復。