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參數(shù)資料
| 型號： | UPD72874GC-YEB |
| 廠商： | NEC Corp. |
| 英文描述： | IEEE1394 OHCI 1.1 COMPLIANT 3PORT PHY-LINK 1-CHIP HOST CONTROLLER |
| 中文描述： | IEEE1394連接的OHCI 1.1標(biāo)準(zhǔn)3PORT物理層鏈路1 -芯片的主機控制器 |
| 文件頁數(shù)： | 35/40頁 |
| 文件大?。?/td> | 297K |
| 代理商： | UPD72874GC-YEB |
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Preliminary Data Sheet S15306EJ2V0DS
35
μ
PD72874
7. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD72874 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 7-1. Surface Mounting Type Soldering Conditions
μ
PD72874GC-YEB: 120-pin plastic TQFP (Fine pitch) (14 x 14)
Soldering
Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec. Max. (at 210
°
C or higher).
Count: three times or less
Exposure limit: 3 days
Note
(after that prebake at 125
°
C for 10 hours)
IR35-103-3
Partial heating
Pin temperature: 300
°
C Max., Time: 3 sec. Max. (per pin row)
—
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
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