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參數(shù)資料
| 型號(hào)： | UPD75068CU |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機(jī) |
| 文件頁(yè)數(shù)： | 62/68頁(yè) |
| 文件大小： | 640K |
| 代理商： | UPD75068CU |
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62
μ
PD75064, 75066, 75068, 75064(A), 75066(A), 75068(A)
13. RECOMMENDED SOLDERING CONDITIONS
Solder the
μ
PD75064, 75066, 75068 under the soldering conditions indicated below.
For further information on the recommended soldering conditions, refer to information document
"SEMI-
CONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (IEI-1207)"
.
For soldering methods and conditions other than those of recommended, consult NEC.
Table 13-1. Soldering Conditions for Surface Mounting Devices
μ
PD75064GB-
×××
-3B4 : 44-pin plastic QFP (10 x 10 mm)
μ
PD75066GB-
×××
-3B4 : 44-pin plastic QFP (10 x 10 mm)
μ
PD75068GB-
×××
-3B4 : 44-pin plastic QFP (10 x 10 mm)
μ
PD75064GB(A)-
×××
-3B4 : 44-pin plastic QFP (10 x 10 mm)
μ
PD75066GB(A)-
×××
-3B4 : 44-pin plastic QFP (10 x 10 mm)
μ
PD75068GB(A)-
×××
-3B4 : 44-pin plastic QFP (10 x 10 mm)
Soldering conditions
Peak temperature of package surface : 235
°
C, Time : 30 seconds
max. (210
°
C min.), Number of reflow processes : 2 or less
<Note>
(1) Start second reflow after the device temperature, which rose
because of the first reflow, has dropped to the normal level.
(2) Do not clean the flux with water after the first reflow.
Peak temperature of package surface : 215
°
C, Time : 40 seconds
max. (200
°
C min.), Number of reflow processes : 2 or less
<Note>
(1) Start second reflow after the device temperature, which rose
because of the first reflow, has dropped to the normal level.
(2) Do not clean the flux with water after the first reflow.
Solder temperature : 260
°
C max., Time : 10 seconds max., Number
of reflow processes : 1
Preheating temperature : 120
°
C max. (package surface temperature)
Pin temperature : 300
°
C max., Time : 3 seconds max., (per one side
of device)
Soldering method
Infrared ray reflow
VPS
Wave soldering
Partial heating
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
—
Caution Do not apply two or more soldering methods (except partial heating method) to the same device.
#
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