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參數(shù)資料
| 型號(hào)： | UPD75304B |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機(jī) |
| 文件頁(yè)數(shù)： | 68/76頁(yè) |
| 文件大小： | 572K |
| 代理商： | UPD75304B |
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68
μ
PD75304B,75306B,75308B
(3)
μ
PD75304BGK-
×××
-3B9: 80-Pin Plastic TQFP (
I
I
12 mm)
μ
PD75306BGK-
×××
-3B9: 80-Pin Plastic TQFP (
I
I
12 mm)
μ
PD75308BGK-
×××
-3B9: 80-Pin Plastic TQFP (
I
I
12 mm)
Soldering Method
Soldering ConditionsRecommended
Condition Symbol
Package peak temperature: 230
°
C Duration: 30 sec. max. (210
°
C or above)
Number of applications: one
Time limit: 1 day
*
(thereafter 16 hours 125
°
C prebaking required)
Infrared reflow
Package peak temperature: 215
°
C Duration: 40 sec. max. (200
°
C or above)
Number of applications: one
Time limit: 1 day
*
(thereafter 16 hours 125
°
C prebaking required)
VPS
Pin part heating
Pin part temperature: 300
°
C or less
Duration: 3 sec. max. (per side of device)
IR30-161-1
VP15-161-1
*
For the storage period after dry-pack decapsulation, storage conditions are max. 25
°
C, 65% RH.
Note
Use of more than one soldering method should be avoided (except in the case of pin part heating).
NOTICE
Recommended soldering conditions have been improved for some of these products.
(Improvements: Relaxation of infrared reflow peak temperature (235
°
C, number of applications (two),
time limit, etc.)
Please contact your NEC sales representative for details.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD75304BGC | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| UPD75304BGF | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| UPD75304BGK | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| UPD75306B | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| UPD75306BGC | 4-BIT SINGLE-CHIP MICROCOMPUTER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD75304GF-407-3B9 | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD75306G182 | 制造商:Panasonic Industrial Company 功能描述:IC |
| UPD75308F478 | 制造商:Panasonic Industrial Company 功能描述:IC |
| UPD75308G699 | 制造商:Panasonic Industrial Company 功能描述:IC |
| UPD753204013 | 制造商:Panasonic Industrial Company 功能描述:IC |
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