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參數(shù)資料
| 型號(hào)： | UPD75312BGK |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機(jī) |
| 文件頁(yè)數(shù)： | 72/77頁(yè) |
| 文件大?。?/td> | 587K |
| 代理商： | UPD75312BGK |
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72
μ
PD75312B, 75316B
μ
PD75312BGK-
×××
-3B9
: 80-pin plastic QFP (12 x 12 mm)
μ
PD75316BGK-
×××
-3B9
: 80-pin plastic QFP (12 x 12 mm)
Recommended
Condition Symbol
Package peak temperature: 235
°
C, Time: Within 30 s (at 210
°
C or higher), Count:
Twice or less, Exposure limit : Seven
*
days (after seven days, prebake at 125
°
C
is required for 10 hours)
<Attention>
(1)
Perform the second reflow when the device temperature has come down to
the room temperature from the heating by the first reflow.
Do not wash flux away with water after the first reflow.
(2)
Package peak temperature: 215
°
C, Time: Within 40 s (at 200
°
C or higher), Count:
Twice or less, Exposure limit : Seven
*
days (after seven days, prebake at 125
°
C
is required for 10 hours)
<Attention>
(1)
Perform the second reflow at the time the device temperature has come down
to the room temperature from the heating by the first reflow.
Do not wash flux away with water after the first reflow.
(2)
Pin temperature: 300
°
C or less, Time: Within 3 s (per side of device)
Caution:
Do not use several soldering methods in combination (except partial heating).
*
For the storage period after dry-pack decapsulation, storage conditions are max. 25
°
C, 65 % RH.
Infrared reflow
VPS
Soldering Method
Soldering Conditions
IR35-107-2
VP15-107-2
Partial heating
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PDF描述 |
|---|---|
| UPD75316B | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| UPD75316BGC | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| UPD75316BGK | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| UPD75312 | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| UPD75316GFA | 4-BIT SINGLE-CHIP MICROCOMPUTER |
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