參數(shù)資料
型號(hào)： UPD75316BGK
廠商： NEC Corp.
英文描述： 4-BIT SINGLE-CHIP MICROCOMPUTER
中文描述： 4位單片機(jī)
文件頁(yè)數(shù)： 71/77頁(yè)
文件大小： 587K
代理商： UPD75316BGK
71
μ
PD75312B, 75316B
14. RECOMMENDED SOLDERING CONDITIONS
The product
should be soldered and mounted under the conditions recommended in the table below.
For the details of recommended soldering conditions, refer to the information document “
Semiconductor Device
Mounting Technology Manual
” (IEI-1207).
For soldering methods and conditions other than those recommended below, contact an NEC sales represen-
tative.
Table 14-1 Surface Mounting Type Soldering Conditions
μ
PD75312BGC-
×××
-3B9
: 80-pin plastic QFP (14 x 14 mm)
μ
PD75316BGC-
×××
-3B9
: 80-pin plastic QFP (14 x 14 mm)
Recommended
Condition Symbol
Package peak temperature: 235
°
C, Time: Within 30 s (at 210
°
C or higher), Count:
Twice or less
<Attention>
(1)
Perform the second reflow when the device temperature has come down to
the room temperature from the heating by the first reflow.
Do not wash flux away with water after the first reflow.
(2)
Package peak temperature: 215
°
C, Time: Within 40 s (at 200
°
C or higher), Count:
Twice or less
<Attention>
(1)
Perform the second reflow when the device temperature has come down to
the room temperature from the heating by the first reflow.
Do not wash flux away with water after the first reflow.
(2)
Soldering tank temperature: 260
°
C or less, Time: Within 10 s, Count: Once,
Preheating temperature: 120
°
C MAX. (package surface temperature)
Pin temperature: 300
°
C or less, Time: Within 3 s (per side of device)
IR35-00-2
VP15-00-2
WS60-00-1
Partial heating
Infrared reflow
VPS
Wave soldering
Caution:
Do not use several soldering methods in combination (except partial heating).
Soldering Method
Soldering Conditions
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