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參數(shù)資料
| 型號： | UPD753208 |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 4位單晶片微控制器 |
| 文件頁數(shù)： | 71/80頁 |
| 文件大小： | 577K |
| 代理商： | UPD753208 |
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71
μ
PD753204, 753206, 753208
15. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD753208 should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document
“Semiconductor Device
Mounting Technology Manual” (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 15-1. Surface Mounting Type Soldering Conditions
μ
PD753204GT-xxx
μ
PD753206GT-xxx
μ
PD753208GT-xxx
: 48-pin plastic shrink SOP (375 mils, 0.65-mm pitch)
: 48-pin plastic shrink SOP (375 mils, 0.65-mm pitch)
: 48-pin plastic shrink SOP (375 mils, 0.65-mm pitch)
Soldering
Method
Soldering Conditions
Symbol
Infrared rays
reflow
Peak package's surface temperature: 235C, Reflow time: 30 seconds or less
(at 210C or higher), Number of reflow processes: Twice max.
IR35-00-2
VPS
Peak package's surface temperature: 215C, Reflow time: 40 seconds or less
(at 200C or higher), Number of reflow processes: Twice max.
VP15-00-2
Wave soldering
Solder temperature: 260C or below, Flow time: 10 seconds or less, Number of
flow process: 1, Preheating temperature: 120C or below (Package surface
temperature)
WS60-00-1
Partial heating
Pin temperature: 300C or below, Time: 3 seconds or less (per device side)
—
Caution
Use of more than one soldering method should be avoided (except for partial heating).
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