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參數(shù)資料
| 型號： | UPD75517GF-xxx-3B9 |
| 廠商： | NEC Corp. |
| 英文描述： | 4 BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機 |
| 文件頁數(shù)： | 5/40頁 |
| 文件大?。?/td> | 320K |
| 代理商： | UPD75517GF-XXX-3B9 |
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5
μ
PD75P048
CONTENTS
1.
PIN FUNCTIONS·························································································································
1.1
PORT PINS ··········································································································································
1.2
NON-PORT PINS·································································································································
1.3
PIN INPUT/OUTPUT CIRCUITS ········································································································
6
6
8
10
2.
DIFFERENCES BETWEEN THE
μ
PD75P048 AND THE
μ
PD75048 ······································· 13
3.
PROM (PROGRAM MEMORY) WRITE AND VERIFY····························································· 14
3.1
PROM WRITE AND VERIFY OPERATION MODE··········································································
3.2
PROM WRITE PROCEDURE ··············································································································
3.3
PROM READ PROCEDURE················································································································
14
15
16
4.
SCREENING OF ONE-TIME PROM MODEL··········································································· 17
5.
ELECTRICAL SPECIFICATIONS ·································································································· 18
6.
PERFORMANCE CURVE (REFERENCE VALUE)····································································· 32
7.
PACKAGE DRAWINGS··············································································································· 34
8.
RECOMMENDED SOLDERING CONDITIONS ········································································· 36
APPENDIX A. DEVELOPMENT TOOLS ·························································································· 37
APPENDIX B. RELATED DOCUMENTS ·························································································· 38
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