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參數(shù)資料
| 型號： | UPD77015GC |
| 廠商： | NEC Corp. |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | 16 bits, Fixed-point Digital Signal Processor |
| 中文描述： | 16位定點數(shù)字信號處理器 |
| 文件頁數(shù)： | 55/60頁 |
| 文件大?。?/td> | 424K |
| 代理商： | UPD77015GC |
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μ
PD77015, 77017, 77018
55
μ
PD77017GC-
×××
-9EU: 100-pin plastic TQFP (FINE PITCH) (14mm
×
14mm)
μ
PD77018GC-
×××
-9EU: 100-pin plastic TQFP (FINE PITCH) (14mm
×
14mm)
Peak temperature: 235 C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 C or higher),
Maximum number of reflow processes : 2 times,
Exposure limit
Note
: 3 days (10 hours pre-baking is required at 125 C
afterwards).
Peak temperature: 215 C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 C or higher),
Maximum number of reflow processes : 2 times,
Exposure limit
Note
: 3 days (10 hours pre-baking is required at 125
°
C
afterwards).
Pin temperature : 300 C or below,
Heat time : 3 seconds or less (Per each side of the device)
Process
Conditions
Symbol
I
nfrared ray reflow
IR35-103-2
Vapor Phase Soldering
Partial heating method
VP15-103-2
Note
Maximum allowable time from taking the soldering package out of dry pack to soldering.
Storage conditions: 25
°
C and relative humidity of 65 % or less.
Caution
Apply only one kind of soldering condition to a device, except for “partial heating method”,
or the device will be damaged by heat stress.
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