參數(shù)資料
型號： UPD77114
廠商： NEC Corp.
英文描述： MOS INTEGRATED CIRCUIT
中文描述： 馬鞍山集成電路
文件頁數(shù)： 9/62頁
文件大?。?/td> 352K
代理商： UPD77114
Data Sheet U14373EJ3V0DS
9
μ
PD77113A, 77114
CONTENTS
1. PIN FUNCTION.................................................................................................................................
1.1 Pin Function Description..........................................................................................................
1.2 Connection of Unused Pins .....................................................................................................
10
10
15
2. FUNCTION OUTLINE .......................................................................................................................
2.1 Program Control Unit................................................................................................................
2.2 Arithmetic Unit...........................................................................................................................
2.3 Data Memory Unit......................................................................................................................
2.4 Peripheral Units.........................................................................................................................
17
17
18
19
19
3. CLOCK GENERATOR......................................................................................................................
20
4. RESET FUNCTION...........................................................................................................................
4.1 Hardware Reset .........................................................................................................................
4.2 Initializing PLL...........................................................................................................................
20
20
21
5. FUNCTIONS OF BOOT-UP ROM...................................................................................................
5.1 Boot at Reset .............................................................................................................................
5.2 Reboot........................................................................................................................................
5.3 Signature Operation..................................................................................................................
5.4 Instruction ROM Modification..................................................................................................
21
21
22
23
23
6. STANDBY MODES...........................................................................................................................
6.1 HALT Mode.................................................................................................................................
6.2 STOP Mode ................................................................................................................................
24
24
24
7. MEMORY MAP..................................................................................................................................
7.1 Instruction Memory...................................................................................................................
7.2 Data Memory..............................................................................................................................
25
25
27
8. MASK OPTION .................................................................................................................................
8.1 Clock Control Options ..............................................................................................................
8.2 WAKEUP Function ....................................................................................................................
28
28
29
9. INSTRUCTIONS.................................................................................................................................
9.1 Outline of Instructions..............................................................................................................
9.2 Instruction Set and Operation..................................................................................................
30
30
31
10. ELECTRICAL SPECIFICATIONS.....................................................................................................
37
11. PACKAGE DRAWINGS....................................................................................................................
56
12. RECOMMENDED SOLDERING CONDITIONS...............................................................................
58
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