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參數(shù)資料
| 型號(hào)： | UPD7759GC-3BH |
| 廠商： | NEC Corp. |
| 英文描述： | ADPCM SPEECH SYNTHESIZER LSIs |
| 中文描述： | 差分PcM語音合成器大規(guī)模集成電路 |
| 文件頁數(shù)： | 17/18頁 |
| 文件大?。?/td> | 183K |
| 代理商： | UPD7759GC-3BH |
μ
PD7759
17
4. RECOMMENDED SOLDERING CONDITIONS
The following conditions (see tables below) must be met when soldering the
μ
PD7759. Please consult
with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
For more details, refer to our document "
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL
" (IEI-1207).
G
G
TYPE OF SURFACE MOUNT DEVICE
μ
PD7759GC-3BH:52-pin plastic QFP (
I
I
14 mm)
Soldering Process
Soldering Conditions
Symbol
Solder temperature: 260
°
C or below,
Flow time: 10 seconds or below,
Temperature of pre-heat: 120
°
C or below (Plastic surface temperature),
Number of flow process: 1
Peak package's surface temperature: 230
°
C or below,
Reflow time: 30 seconds or below (210
°
C or higher),
Number of reflow process: 1
Infrared Ray Reflow
IR30-00-1
Peak package's temperature: 215
°
C or below,
Reflow time: 40 seconds or below (200
°
C or higher),
Number of reflow process: 1
VPS
VP15-00-1
Terminal temperature: 300
°
C or below,
Time: 3 seconds or below (Per one side of the device)
Caution Do not apply more than one soldering method at any one time, except for "Partial heating method".
G
G
TYPE OF THROUGH HOLE DEVICE
μ
PD7759C:40-pin plastic DIP (600mil)
Soldering Process
Soldering Conditions
Wave Soldering
(only lead part)
Solder Temperature: 260
°
C or below
Flow time: 10 seconds or below
Terminal temperature: 260
°
C or below
Time: 10 seconds or below
Caution Do not jet molten solder on the surface of package.
#
Partial Heating Method
—
Wave Soldering
WS60-00-1
Partial Heating Method
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