- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄378748 > UPD780022AY (NEC Corp.) 8-BIT SINGLE-CHIP MICROCONTROLLERS PDF資料下載
參數(shù)資料
| 型號： | UPD780022AY |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 8位單晶片微控制器 |
| 文件頁數(shù)： | 75/90頁 |
| 文件大?。?/td> | 660K |
| 代理商： | UPD780022AY |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁當前第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁
μ
PD78F0034B, 78F0034BY, 78F0034B(A), 78F0034BY(A)
75
Data Sheet U16369EJ1V0DS
11. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78F0034B, 78F0034BY, 78F0034B(A), and 78F0034BY(A) should be soldered and mounted under
the following recommended conditions.
For details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
Table 11-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD78F0034BGB-8EU:
μ
PD78F0034BGB(A)-8EU:
μ
PD78F0034BYGB-8EU:
μ
PD78F0034BYGB(A)-8EU: 64-pin plastic LQFP (10 x 10)
64-pin plastic LQFP (10 x 10)
64-pin plastic LQFP (10 x 10)
64-pin plastic LQFP (10 x 10)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
(2)
μ
PD78F0034BGC-8BS:
μ
PD78F0034BGC(A)-8BS:
μ
PD78F0034BYGC-8BS:
μ
PD78F0034BYGC(A)-8BS: 64-pin plastic LQFP (14 x 14)
64-pin plastic LQFP (14 x 14)
64-pin plastic LQFP (14 x 14)
64-pin plastic LQFP (14 x 14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Caution Do not use different soldering methods together (except for partial heating).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD780024AY | 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash |
| UPD780031A | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD780033A | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD780034AS | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD780205 | 8-Bit Single-Chip Microcontrollers |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD780023AGB-G43-8EU-X3-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780023AGB-G44-8EU-E3-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780023AGC-107-8BS-A | 制造商:Renesas Electronics Corporation 功能描述:NECUPD780023AGC-107-8BS-A MASK ROM DEVIC |
| UPD780023AGK-C74-9ET-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780024AGK-C42-9ET | 制造商:Renesas Electronics Corporation 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復。