參數(shù)資料
型號(hào): UPD784215AYGF
廠商: NEC Corp.
英文描述: 16-BIT SINGLE-CHIP MICROCONTROLLERS
中文描述: 16位單晶片微控制器
文件頁數(shù): 90/100頁
文件大?。?/td> 561K
代理商: UPD784215AYGF
Data Sheet U14121EJ2V0DS00
90
μ
PD784214A, 784215A, 784216A, 784217A, 784218A, 784214AY, 784215AY, 784216AY, 784217AY, 784218AY
15. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD784218A should be soldered and mounted under the following recommended conditions. For the details
of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting Technology
Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 15-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD784214AGC-
μ
PD784215AGC-
μ
PD784216AGC-
×××
μ
PD784217AGC-
μ
PD784218AGC-
μ
PD784214AYGC-
μ
PD784215AYGC-
μ
PD784216AYGC-
×××
μ
PD784217AYGC-
μ
PD784218AYGC-
×××
-8EU:100-pin plastic LQFP(fine pitch) (14
×
14 mm)
×××
-8EU:100-pin plastic LQFP(fine pitch) (14
×
14 mm)
-8EU:100-pin plastic LQFP(fine pitch) (14
×
14 mm)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
×××
-8EU:100-pin plastic LQFP(fine pitch) (14
×
14 mm)
×××
-8EU:100-pin plastic LQFP(fine pitch) (14
×
14 mm)
-8EU:100-pin plastic LQFP(fine pitch) (14
×
14 mm)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less, Exposure limit: 7 days
for 10 hours)
Note
(after that, prebake at 125
°
C
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less, Exposure limit: 7 days
for 10 hours)
Note
(after that, prebake at 125
°
C
VP15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
相關(guān)PDF資料
PDF描述
UPD784216AGC 16-BIT SINGLE-CHIP MICROCONTROLLERS
UPG173TA L-BAND PA DRIVER AMPLIFIER
UPG173TA-E3 L-BAND PA DRIVER AMPLIFIER
UPG2008TB-E3 GaAs INTEGRATED CIRCUIT
UPG2121TB L-BAND UP/DOWN CONVERTER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD784218AGC-382-8EU-NRE-A 制造商:Renesas Electronics Corporation 功能描述:
UPD784218AGC-382-8EU-SES-A 制造商:Renesas Electronics Corporation 功能描述:
UPD784935AGF-113-3BA 制造商:NEC Electronics Corporation 功能描述:
UPD784938AGF-188-3BA 制造商:NEC Electronics Corporation 功能描述:
UPD789104AMC(A)-968-5A4-E2 制造商:Renesas Electronics Corporation 功能描述: