
μ
PD78P4038Y
6
CONTENTS
1.
DIFFERENCES BETWEEN
μ
PD78P4038Y AND MASKED ROM PRODUCTS ....................
7
2.
PIN CONFIGURATION (TOP VIEW) .........................................................................................
8
3.
BLOCK DIAGRAM .....................................................................................................................
11
4.
LIST OF PIN FUNCTIONS .........................................................................................................
4.1
Pins for Normal Operating Mode.................................................................................................
4.2
Pins for PROM Programming Mode (V
PP
≥
+5 V or +12.5 V, RESET = L) ..............................
4.2.1
Pin functions ..................................................................................................................
4.2.2
Pin functions ..................................................................................................................
4.3
I/O Circuits for Pins and Handling of Unused Pins ..................................................................
12
12
15
15
16
17
5.
INTERNAL MEMORY SWITCHING (IMS) REGISTER ............................................................
20
6.
PROM PROGRAMMING ............................................................................................................
6.1
Operation Mode..............................................................................................................................
6.2
PROM Write Sequence..................................................................................................................
6.3
PROM Read Sequence ..................................................................................................................
21
21
23
27
7.
ERASURE CHARACTERISTICS (
μ
PD78P4038YKK-T ONLY)...............................................
28
8.
PROTECTIVE FILM COVERING THE ERASURE WINDOW (
μ
PD78P4038YKK-T ONLY) ..
28
9.
QUALITY .....................................................................................................................................
28
10. SCREENING ONE-TIME PROM PRODUCTS ..........................................................................
28
11. ELECTRICAL CHARACTERISTICS .........................................................................................
29
12. PACKAGE DRAWINGS .............................................................................................................
55
13. RECOMMENDED SOLDERING CONDITIONS ........................................................................
59
APPENDIX A DEVELOPMENT TOOLS ..........................................................................................
61
APPENDIX B CONVERSION SOCKET (EV-9200GC-80) AND CONVERSION ADAPTER
(TGK-080SDW)..........................................................................................................
64
APPENDIX C RELATED DOCUMENTS..........................................................................................
67