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Fiber Optics
May 2000
V23814-K1306-M230
Parallel Optical Link: PAROLI Tx DC/MUX-ENC
V23815-K1306-M230
Parallel Optical Link: PAROLI Rx DC/DEMUX-DEC
FEATURES
Power supply (3.3 V)
Low voltage differential signal electrical interface (LVDS)
22 electrical data + 1 clock channels
Low skew, bit parallel transmission
Interface to SCI and HIPPI 6400 standard
12 optical data channels
Electrical transmission data rate of 150-500 Mbit/s per
channel, total link data rate up to 11 Gbit/s
Two clocking modes can be selected (SCI/Strobe)
Transmission distance up to 75 m at maximum data rate
850 nm VCSEL array technology
PIN diode array technology
62.5
μ
m graded index multimode fiber ribbon
MT based optical port
SMD technology
Class 1 FDA and Class 3A IEC laser safety compliant
FC open fiber interface supported (to configure a Class 1
IEC laser safety compliant system)
APPLICATIONS
Telecommunication
Switching equipment
Access network
Data Communication
Interframe (rack-to-rack)
Intraframe (board-to-board)
On board (optical backplane)
Absolute Maximum Ratings
Stress beyond the values stated below may cause permanent
damage to the device. Exposure to absolute maximum rating
conditions for extended periods of time may affect
device reliability.
Supply Voltage (V
CC
–V
EE
)....................................–0.3 V to 4.5 V
Data/Control Input Levels (V
IN
)
(1)
................ –0.5 V to V
CC
+0.5 V
LVDS Input Differential Voltage (
|V
ID
|
)
(2)
.............................. 2.0 V
Operating Case Temperature (T
CASE
)
(3)
...............0°C to 80°C
Storage Ambient Temperature (T
STG
)................ –20°C to 100°C
Operating Moisture ...............................................20% to 85%
Storage Moisture....................................................20% to 85%
Soldering Conditions Temp/Time (T
SOLD,
t
SOLD
)
(4)
....260°C/10s
ESD Resistance (all pins to V
EE
human body model)
(5)
....... 1 kV
Notes
1. At LVDS and LVCMOS inputs.
2. |V
ID
|=|(input voltage of non-inverted input minus input voltage of
inverted input)|.
3. Measured at case temperature reference point (see dimensional
drawing, Figure 13 on page 12).
4. Hot bar or hot air soldering.
5. To avoid electrostatic damage, handling cautions similar those used
for MOS devices must be observed.