參數(shù)資料
型號(hào): VSC7135
廠商: Vitesse Semiconductor Corporation.
英文描述: 1.25Gbits/sec Gigabit Ethernet Transceiver
中文描述: 1.25Gbits/sec千兆以太網(wǎng)收發(fā)器
文件頁數(shù): 14/16頁
文件大?。?/td> 138K
代理商: VSC7135
VITESSE
Data Sheet
VSC7135
1.25Gbits/sec
Gigabit Ethernet Transceiver
Page 14
VITESSE
SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 805/388-3700 FAX: 805/987-5896
5/28/98
G52146-0, Rev. 4.0
Package Thermal Considerations
The VSC7135 is packaged in a 14 mm conventional PQFP with an internal heat spreader. This package use
an industry-standard EIAJ footprint, but have been enhanced to improve thermal dissipation. The construction
of the packages are as shown in Figure 12.
Figure 10: Package Cross Section - 14 mm package
Table 5: Thermal Resistance
The VSC7135 is designed to operate with a junction temperature up to 105
o
C. The user must guarantee that
the temperature specification is not violated. With the Thermal Resistances shown above, the 10x10 PQFP can
operate in still air ambient temperatures of 55
o
C [55
o
C=110
o
C-0.9W*(10
o
C/W+50.8
o
C/W)] while the 14x14
PQFP can operate in still air ambient temperatures of 75
o
C [75
o
C=110
o
C-0.9W*(9.5
o
C/W+29
o
C/W)]. If the
ambient air temperature exceeds these limits then some form of cooling through a heatsink or an increase in air-
flow must be provided.
Moisture Sensitivity Level
This device is rated with a moisture sensitivity level 3 rating. Refer to Application Note AN-20 for appro-
priate handling procedures.
Symbol
θ
jc
θ
ca
Description
10mm Value
14mm Value
Units
Thermal resistance from junction to case
10.0
9.5
o
C/W
Thermal resistance from case to ambient in still air including
conduction through the leads.
50.8
29
o
C/W
θ
ca-100
θ
ca-200
θ
ca-400
θ
ca-600
Thermal resistance from case to ambient with 100 LFM airflow
41.2
26.1
o
C/W
Thermal resistance from case to ambient with200 LFM airflow
36.9
23.8
o
C/W
Thermal resistance from case to ambient with 400 LFM airflow
31.8
20.5
o
C/W
Thermal resistance from case to ambient with 600 LFM airflow
27.8
17.9
o
C/W
Copper Heat Spreader
Die
Plastic Molding Compound
Lead
Bond Wire
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