參數(shù)資料
型號(hào)： W25X20-VSSI-G
廠商： WINBOND ELECTRONICS CORP
元件分類： PROM
英文描述： 2M X 1 FLASH 2.7V PROM, PDSO8
封裝： 0.208 INCH, GREEN, PLASTIC, SOIC-8
文件頁(yè)數(shù)： 12/42頁(yè)
文件大?。?/td> 1198K
代理商： W25X20-VSSI-G
W25X10, W25X20, W25X40 AND W25X80
- 2 -
Table of Contents-
1.
GENERAL DESCRIPTION ......................................................................................................... 4
2.
FEATURES ................................................................................................................................. 4
3.
PIN CONFIGURATION 150-MIL................................................................................................. 5
4.
PIN DESCRIPTION 150-MIL ...................................................................................................... 5
5.
PIN CONFIGURATION 208-MIL................................................................................................. 6
6.
PIN DESCRIPTION 208-MIL ...................................................................................................... 6
6.1
Package Types ............................................................................................................... 7
6.2
Chip Select (/CS) ............................................................................................................ 7
6.3
Serial Data Output (DO) ................................................................................................. 7
6.4
Write Protect (/WP) ......................................................................................................... 7
6.5
HOLD (/HOLD) ............................................................................................................... 7
6.6
Serial Clock (CLK) .......................................................................................................... 7
6.7
Serial Data Input / Output (DIO) ..................................................................................... 7
7.
BLOCK DIAGRAM ...................................................................................................................... 8
8.
FUNCTIONAL DESCRIPTION ................................................................................................... 9
8.1
SPI OPERATIONS ......................................................................................................... 9
8.1.1
SPI Modes........................................................................................................................9
8.1.2
Dual Output SPI ...............................................................................................................9
8.1.3
Hold Function ...................................................................................................................9
8.2
WRITE PROTECTION.................................................................................................. 10
8.2.1
Write Protect Features ...................................................................................................10
9.
CONTROL AND STATUS REGISTERS................................................................................... 11
9.1
STATUS REGISTER .................................................................................................... 11
9.1.1
BUSY .............................................................................................................................11
9.1.2
Write Enable Latch (WEL) ..............................................................................................11
9.1.3
Block Protect Bits (BP2, BP1, BP0)................................................................................11
9.1.4
Top/Bottom Block Protect (TB).......................................................................................11
9.1.5
Reserved Bits .................................................................................................................11
9.1.6
Status Register Protect (SRP)........................................................................................12
9.1.7
Status Register Memory Protection ................................................................................13
9.2
INSTRUCTIONS ........................................................................................................... 14
9.2.1
Manufacturer and Device Identification ..........................................................................14
9.2.2
Instruction Set
(1) ............................................................................................................15
9.2.3
Write Disable (04h).........................................................................................................16
9.2.4
Write Enable (06h) .........................................................................................................16
9.2.5
Read Status Register (05h) ............................................................................................17
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