參數(shù)資料
型號: W25X80ALDAIZ
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 1M X 8 FLASH 2.7V PROM, PDIP8
封裝: 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
文件頁數(shù): 30/45頁
文件大小: 1342K
代理商: W25X80ALDAIZ
W25X10AL, W25X20AL, W25X40AL, W25X80AL
- 36 -
11.8 AC Electrical Characteristics (cont’d)
SPEC
DESCRIPTION
SYMBOL
ALT
MIN
TYP
MAX
UNIT
/HOLD Active Setup Time relative to CLK
tHLCH
5
ns
/HOLD Active Hold Time relative to CLK
tCHHH
5
ns
/HOLD Not Active Setup Time relative to CLK
tHHCH
5
ns
/HOLD Not Active Hold Time relative to CLK
tCHHL
5
ns
/HOLD to Output Low-Z
tHHQX(2)
tLZ
7
ns
/HOLD to Output High-Z
tHLQZ(2)
tHZ
12
ns
Write Protect Setup Time Before /CS Low
tWHSL(3)
20
ns
Write Protect Hold Time After /CS High
tSHWL(3)
100
ns
/CS High to Power-down Mode
tDP(2)
3
s
/CS High to Standby Mode without Electronic
Signature Read
tRES1(2)
3
s
/CS High to Standby Mode with Electronic
Signature Read
tRES2(2)
1.8
s
Write Status Register Time
tW
10
15
ms
Byte Program Time (First Byte) (5)
tBP1
30
50
s
Additional Byte Program Time (After First Byte) (5)
tBP2
6
12
s
Page Program Time
tPP
1.5
3
ms
Sector Erase Time (4KB)
tSE
120
500
ms
Block Erase Time (64KB)
tBE
0.4
1
s
Chip Erase Time W25X10AL / W25X20AL
Chip Erase Time W25X40AL
Chip Erase Time W25X80AL
tCE
1.5
3
6
3
5
10
s
Notes:
1.
Clock high + Clock low must be less than or equal to 1/fC.
2.
Value guaranteed by design and/or characterization, not 100% tested in production.
3.
Only applicable as a constraint for a Write Status Register instruction when Sector Protect Bit is set to 1.
4.
Commercial temperature only applies to Fast Read (FR1). Industrial temperature applies to all other parameters.
5.
For multiple bytes after first byte within a page,
tBPN = tBP1 + tBP2 * N (typical) and tBPN = tBP1 + tBP2 * N (max), where
N = number of bytes programmed.
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