參數(shù)資料
型號: W3DG7237V75D2
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: DRAM
英文描述: 32M X 72 SYNCHRONOUS DRAM MODULE, DMA168
封裝: DIMM-168
文件頁數(shù): 3/6頁
文件大?。?/td> 143K
代理商: W3DG7237V75D2
3
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W3DG7237V-D2
June 2004
Rev. 0
PRELIMINARY
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Value
Units
Voltage on any pin relative to VSS
VIN, VOUT
-1.0 ~ 4.6
V
Voltage on VCC supply relative to VSS
VCC, VCCQ
-1.0 ~ 4.6
V
Storage Temperature
TSTG
-55 ~ +150
°C
Power Dissipation
PD
9
Ω
Short Circuit Current
IOS
50
mA
Note: Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
Voltage Referenced to: VSS = 0V, 0°C ≤ TA ≤ 70°
Parameter
Symbol
Min
Typ
Max
Unit
Note
Supply Voltage
VCC
3.0
3.3
3.6
V
Input High Voltage
VIH
2.0
3.0
VCCQ+0.3
V
1
Input Low Voltage
VIL
-0.3
0.8
V
2
Output High Voltage
VOH
2.4
V
IOH= -2mA
Output Low Voltage
VOL
0.4
V
IOL= -2mA
Input Leakage Current
ILI
-10
10
μA3
Note: 1. VIH (max)= 5.6V AC. The overshoot voltage duration is ≤ 3ns.
2. VIL (min)= -2.0V AC. The undershoot voltage duration is ≤ 3ns.
3. Any input 0V ≤ VIN ≤ VCCQ
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
CAPACITANCE
TA = 25 °C, f = 1MHz, VCC = 3.3V, VREF = 1.4V ± 200mV
Parameter
Symbol
Max
Unit
Input Capacitance (A0-A12)
CIN1
40
pF
Input Capacitance (RAS#,CAS#,WE#)
CIN2
40
pF
Input Capacitance (CKE0)
CIN3
40
pF
Input Capacitance (CLK0)
CIN4
20
pF
Input Capacitance (CS0#,CS2#)
CIN5
24
pF
Input Capacitance (DQM0-DQM7)
CIN6
7pF
Input Capacitance (BA0-BA1)
CIN7
40
pF
Data input/output capacitance (DQ0-DQ63)
COUT
9pF
Data input/output capacitance (CB0-CB7)
COUT1
9pF
相關(guān)PDF資料
PDF描述
W3E16M64S-250BC 16M X 64 DDR DRAM, 0.8 ns, PBGA219
W3E16M72S-266BI 16M X 72 DDR DRAM, 0.75 ns, PBGA219
W3E16M72S-200BI 16M X 72 DDR DRAM, 0.8 ns, PBGA219
W3E16M72SR-200BM 16M X 72 DDR DRAM, 0.75 ns, PBGA219
W3E16M72SR-200BC 16M X 72 DDR DRAM, 0.75 ns, PBGA219
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W3DG7237V7D2 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:256MB - 32Mx72 SDRAM UNBUFFERED
W3DG7237V-D2 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:256MB - 32Mx72 SDRAM UNBUFFERED
W3DG7263V10D2 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB - 64Mx72 SDRAM, REGISTER and SPD, w/PLL
W3DG7263V75D2 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB - 64Mx72 SDRAM, REGISTER and SPD, w/PLL
W3DG7263V7D2 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB - 64Mx72 SDRAM, REGISTER and SPD, w/PLL