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參數資料
| 型號： | W3H64M72E-533SBI |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | DRAM |
| 英文描述： | 64M X 72 DDR DRAM, 0.5 ns, PBGA208 |
| 封裝： | 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| 文件頁數： | 26/32頁 |
| 文件大?。?/td> | 944K |
| 代理商： | W3H64M72E-533SBI |
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W3H64M72E-XSBX
W3H64M72E-XSBXF
32
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
December 2009
2010 White Electronic Designs Corp. All rights reserved
Rev. 9
White Electronic Designs Corp. reserves the right to change products or specications without notice.
Document Title
64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
Revision History Continued
Rev #
History
Release Date
Status
Rev 7
Changes (Pg. 1, 2, 5, 6, 7, 8, 9, 13, 14, 16, 19, 22 - 28, 30)
7.1 Updated electrical characteristics throughout data sheet
7.2 Removed I/O supply voltage = 1.8V ± 0.1V - (SSTL-18
compatible)
7.3 Corrected SPACE SAVINGS vs FPBGA to Space savings
vs FBGA
7.4 Functional block diagram - Removed note
7.5 Changed VCC = I/O + Core; VCCQ is common to VCC
7.6 Removed VCCQ from Table 1
7.7 Replaced Figure 4 on pg. 7
7.8 Replaced Figure 8 on pg. 8
7.9 Removed VCCQ from CD Operating Conditions, VCC and
VCCQ are tied on the device
October 2008
Final
Rev 8
Changes (Pg: 1, 16, 19, 23)
8.1 Change note 1 of BGA thermal resistance
To obtain the junction temperature increase, multiply the
thermal resistance by the power dissipated in each die in
the MCP.
8.2 Change area and I/O count space savings
8.3 Delete note 3 on page 16
8.4 Add page 19 data
December 2008
Final
Rev 9
Changes (Pg 1, 30)
9.1 Ad Pb free part option, W3H64M72E-XSBXF - "F" denotes
the part is lead free
9.2 Under Ordering Information added SOLDER BALLS -
Blank = Eutectec SN63Pb37 and F = Lead free, SAC305
December 2009
Final
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相關代理商/技術參數 |
參數描述 |
|---|---|
| W3H64M72E-533SBM | 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 533MHZ, 208PBGA MIL-TEMP. - Bulk |
| W3H64M72E-667ES | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-667ESC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-667ESI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-667ESM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
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