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參數(shù)資料
| 型號： | WED2ZL361MSJ35BC |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 1M X 36 MULTI DEVICE SRAM MODULE, 3.5 ns, PBGA119 |
| 封裝： | PLASTIC, BGA-119 |
| 文件頁數(shù)： | 4/12頁 |
| 文件大小： | 0K |
| 代理商： | WED2ZL361MSJ35BC |
12
White Electronic Designs Corporation Westborough MA (508) 366-5151
WED2ZL361MSJ
White Electronic Designs
PACKAGE DIMENSION: 119 BUMP PBGA
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
2.79 (0.110)
MAX
0.711 (0.028)
MAX
1.27 (0.050)
TYP
1.27 (0.050) TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
17.00 (0.669) TYP
A1 CORNER
20.32 (0.800)
TYP
23.00 (0.905)
TYP
7.62 (0.300)
TYP
Ordering Information
Commercial Temp Range (0°C to 70°C)
Part Number
Configuration
tCD
Clock
(ns)
(MHz)
WED2ZL361MSJ26BC
1M x 36
2.6
250
WED2ZL361MSJ28BC
1M x 36
2.8
225
WED2ZL361MSJ30BC
1M x 36
3.0
200
WED2ZL361MSJ35BC
1M x 36
3.5
166
WED2ZL361MSJ38BC
1M x 36
3.8
150
WED2ZL361MSJ42BC
1M x 36
4.2
133
NOTE: Ball attach pad for above BGA package is 620 microns in diameter. Pad is solder mask defined.
Industrial Temp Range (-40°C to +85°C)
Part Number
Configuration
tCD
Clock
(ns)
(MHz)
WED2ZL361MSJ26BI*
1M x 36
2.6
250
WED2ZL361MSJ28BI
1M x 36
2.8
225
WED2ZL361MSJ30BI
1M x 36
3.0
200
WED2ZL361MSJ35BI
1M x 36
3.5
166
WED2ZL361MSJ38BI
1M x 36
3.8
150
WED2ZL361MSJ42BI
1M x 36
4.2
133
* consult factory for availability
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WED2ZL361MSJ-BC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:NBL SSRAM MCP |
| WED2ZL361MV | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx36 Synchronous Pipeline Burst NBL SRAM |
| WED2ZL361MV35BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx36 Synchronous Pipeline Burst NBL SRAM |
| WED2ZL361MV35BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx36 Synchronous Pipeline Burst NBL SRAM |
| WED2ZL361MV38BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx36 Synchronous Pipeline Burst NBL SRAM |
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