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參數(shù)資料
| 型號(hào)： | WEDPS512K32-17BM |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類(lèi)： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, PBGA143 |
| 封裝： | 16 X 18 MM, PLASTIC, BGA-143 |
| 文件頁(yè)數(shù)： | 5/7頁(yè) |
| 文件大?。?/td> | 235K |
| 代理商： | WEDPS512K32-17BM |
WEDPS512K32-XBX
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
November, 2003
Rev.6
PACKAGE 7043: 143 BALL GRID ARRAY
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.61 (0.024)
NOM
1.27
(0.050)
NOM
A
B
C
D
E
F
G
H
J
K
L
M
13.97 (0.550)
NOM
16.25 (0.640)
MAX
18.25 (0.719)
MAX
13.97 (0.550)
NOM
1.93 (0.076) MAX
1.27 (0.050) NOM
BOTTOM VIEW
12 11 10 9 8 7 6 5 4 3 2 1
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WEDPS512K32-20BC | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
| WEDPS512K32-20BI | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
| WEDPS512K32-20BM | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
| WEDPS512K32LV-12BC | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-12BI | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
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